AMD Xilinx
XCZU4CG-2FBVB900I
XCZU4CG-2FBVB900I ECAD Model
XCZU4CG-2FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4CG-2FBVB900I Datasheet Download
XCZU4CG-2FBVB900I Overview
The XCZU4CG-2FBVB900I chip model is a high-performance, low-power, and low-cost programmable logic device designed for digital signal processing, embedded processing, and image processing applications. It is a powerful and versatile chip model that can be used to develop complex systems and applications.
The XCZU4CG-2FBVB900I chip model utilizes the Xilinx UltraScale+ FPGA architecture, which enables the design of high-speed, low-power, and low-cost systems. This chip model is equipped with a variety of features, such as a high-speed transceiver, a rich set of I/O interfaces, and a multi-gigabit transceiver. It also offers a variety of options for the user to customize their system according to their needs.
The XCZU4CG-2FBVB900I chip model is suitable for a wide range of applications, including digital signal processing, embedded processing, image processing, and advanced communication systems. It requires the use of HDL language, which is a powerful and versatile language that allows users to design complex systems and applications.
The XCZU4CG-2FBVB900I chip model is highly reliable and has a long life span. It is designed to be able to withstand high temperatures, and it also has an integrated power management system that helps reduce power usage. The chip model is also designed for scalability, and it is expected that the demand for this chip model will continue to grow in the future as more applications are developed for it.
The original design intention of the XCZU4CG-2FBVB900I chip model was to provide a low-cost, low-power, and high-performance platform for digital signal processing, embedded processing, and image processing applications. It is also designed to be upgradeable, and it is possible to upgrade the chip model to support more advanced communication systems. The XCZU4CG-2FBVB900I chip model also offers a wide range of options for users to customize their system according to their needs.
In conclusion, the XCZU4CG-2FBVB900I chip model is an excellent choice for digital signal processing, embedded processing, image processing, and advanced communication systems. It is reliable, low-cost, low-power, and highly scalable, and it is expected that the demand for this chip model will continue to grow in the future.
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2,705 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,263.1632 | $1,263.1632 |
| 10+ | $1,249.5808 | $12,495.8080 |
| 100+ | $1,181.6688 | $118,166.8800 |
| 1000+ | $1,113.7568 | $556,878.4000 |
| 10000+ | $1,018.6800 | $1,018,680.0000 |
| The price is for reference only, please refer to the actual quotation! | ||