AMD Xilinx
XCZU4CG-2FBVB900E
XCZU4CG-2FBVB900E ECAD Model
XCZU4CG-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU4CG-2FBVB900E Datasheet Download
XCZU4CG-2FBVB900E Overview
The XCZU4CG-2FBVB900E chip model is a powerful and versatile processor that provides a wide range of features and capabilities. It is a highly advanced chip model that is designed to meet the demands of a variety of industries, from automotive to aerospace. The chip model is designed to be extremely reliable and efficient, with a long lifespan and low power consumption.
The XCZU4CG-2FBVB900E chip model is expected to be in high demand in the near future due to its advanced features and capabilities. It is capable of supporting a wide range of applications, from automotive to aerospace, and is ideal for high-performance computing and networking. It is also capable of supporting advanced communication systems, making it a great choice for industries that rely on high-speed data transmission and reliable communication.
The XCZU4CG-2FBVB900E chip model is designed to be easily upgradeable and can be used to create a wide range of intelligent systems. It can be used in networks to improve the efficiency and reliability of data transmission and can be used to create intelligent scenarios in the future. It is also capable of being used in the era of fully intelligent systems, allowing for more advanced applications and capabilities.
The XCZU4CG-2FBVB900E chip model is a powerful and versatile processor that is designed to meet the demands of a variety of industries. It is expected to be in high demand in the near future due to its advanced features and capabilities, and its ability to support a wide range of applications. It is also capable of supporting advanced communication systems and can be used to create a wide range of intelligent systems. With its ability to be easily upgradeable and used in the era of fully intelligent systems, the XCZU4CG-2FBVB900E chip model is sure to be a great choice for a variety of industries.
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5,013 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,104.5424 | $1,104.5424 |
| 10+ | $1,092.6656 | $10,926.6560 |
| 100+ | $1,033.2816 | $103,328.1600 |
| 1000+ | $973.8976 | $486,948.8000 |
| 10000+ | $890.7600 | $890,760.0000 |
| The price is for reference only, please refer to the actual quotation! | ||