
AMD Xilinx
XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E ECAD Model
XCZU4CG-1SFVC784E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Temperature Grade | OTHER | |
JESD-30 Code | S-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA, BGA78428X28,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU4CG-1SFVC784E Datasheet Download
XCZU4CG-1SFVC784E Overview
The XCZU4CG-1SFVC784E chip model is a specialized chip designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful and versatile device that is capable of handling complex tasks and requires the use of HDL language. This chip model is becoming increasingly popular in the industry due to its numerous advantages.
The XCZU4CG-1SFVC784E chip model is designed for high performance and scalability, with a high-speed, low-power architecture that can support multiple use cases. It is also highly customizable, with a wide range of configurations and features that can be tailored to meet specific user needs. Additionally, the chip model is optimized for a variety of applications, including industrial, automotive, medical, and consumer applications.
The XCZU4CG-1SFVC784E chip model is expected to be in high demand in the future due to its numerous advantages. It is designed to meet the needs of a variety of industries, including automotive, industrial, medical, and consumer applications. The chip model is also highly compatible with a range of different technologies, making it an ideal solution for a variety of use cases. Additionally, the chip model is designed to be power-efficient and highly scalable, making it a great choice for applications that require high performance and low power consumption.
The future of the XCZU4CG-1SFVC784E chip model is bright, as the demand for this chip model is expected to increase in the coming years. It is a powerful and versatile device that is capable of handling complex tasks and is highly compatible with a range of different technologies. Additionally, the chip model is designed to be power-efficient and highly scalable, making it a great choice for applications that require high performance and low power consumption. As new technologies become available, the XCZU4CG-1SFVC784E chip model will be able to take advantage of them, ensuring that it remains a popular choice for a variety of applications.
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5,894 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $580.3200 | $580.3200 |
10+ | $574.0800 | $5,740.8000 |
100+ | $542.8800 | $54,288.0000 |
1000+ | $511.6800 | $255,840.0000 |
10000+ | $468.0000 | $468,000.0000 |
The price is for reference only, please refer to the actual quotation! |