AMD Xilinx
XCZU4CG-1FBVB900I
XCZU4CG-1FBVB900I ECAD Model
XCZU4CG-1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4CG-1FBVB900I Datasheet Download
XCZU4CG-1FBVB900I Overview
The XCZU4CG-1FBVB900I chip model is a powerful tool that has been developed to provide a high-performance computing platform with the latest technologies. It is designed to meet the needs of the modern market and is an ideal choice for many applications. This model has a wide range of features that make it a great choice for many applications and industries.
The XCZU4CG-1FBVB900I chip model is built on the latest technologies, such as the Xilinx UltraScale+ FPGA architecture and the Zynq UltraScale+ MPSoC architecture. This model is capable of delivering high-performance processing and computing capabilities. It is also equipped with the latest technologies, such as the ARM Cortex-A53 processor, the ARM Cortex-R5 processor, and the ARM Cortex-M4 processor. This model is also equipped with a range of peripherals, such as DDR4 memory, Ethernet, PCIe, and USB.
The XCZU4CG-1FBVB900I chip model is designed to provide a reliable and high-performance computing platform for a variety of applications. It is ideal for applications such as artificial intelligence, machine learning, embedded systems, and industrial automation. It is also suitable for applications in the automotive, aerospace, and medical industries.
The XCZU4CG-1FBVB900I chip model is expected to be in high demand in the future. The model is expected to be used in the development of intelligent robots and other related industries. To effectively use the chip model, technical talents are needed to understand the model and its capabilities. These technical talents should possess knowledge in the fields of computer architecture, software engineering, and embedded systems.
In conclusion, the XCZU4CG-1FBVB900I chip model is a powerful tool that is designed to provide a high-performance computing platform with the latest technologies. It is expected to be in high demand in the future, and technical talents are needed to effectively use the model. The model is expected to be used in the development of intelligent robots and other related industries. It is a great choice for many applications and industries and is capable of delivering high-performance processing and computing capabilities.
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2,050 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $986.5440 | $986.5440 |
| 10+ | $975.9360 | $9,759.3600 |
| 100+ | $922.8960 | $92,289.6000 |
| 1000+ | $869.8560 | $434,928.0000 |
| 10000+ | $795.6000 | $795,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||