
AMD Xilinx
XCZU47DR-L2FFVG1517I
XCZU47DR-L2FFVG1517I ECAD Model
XCZU47DR-L2FFVG1517I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FLIPCHIP-1517 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2019-02-20 |
XCZU47DR-L2FFVG1517I Datasheet Download
XCZU47DR-L2FFVG1517I Overview
The chip model XCZU47DR-L2FFVG1517I is an innovative product from Xilinx that is designed to provide robust performance and power efficiency. It is a high-performance, low-power, and cost-effective FPGA (Field Programmable Gate Array). It is suitable for a wide range of applications, from consumer electronics and automotive to industrial and medical applications.
The XCZU47DR-L2FFVG1517I chip model has many advantages, such as high-speed processing, low power consumption, and scalability. It is also capable of supporting multiple protocols, including PCIe, Ethernet, and USB. This makes the chip model an ideal choice for applications that require high-speed data processing and low power consumption.
In terms of industry trends, the demand for XCZU47DR-L2FFVG1517I is expected to continue to grow in the future. This is due to its cost-effectiveness, scalability, and high performance. Additionally, it is expected that the chip model will be used in more applications, including artificial intelligence (AI) and machine learning (ML).
The XCZU47DR-L2FFVG1517I chip model can be applied to the development and popularization of future intelligent robots. This is because the chip model is capable of supporting multiple protocols and has low power consumption. Furthermore, the chip model can be used to develop AI and ML applications, which are essential for the development of intelligent robots.
In order to use the XCZU47DR-L2FFVG1517I chip model effectively, certain technical talents are required. This includes knowledge of FPGA design, embedded systems, and AI/ML algorithms. Additionally, the user must have a good understanding of the chip model’s architecture and how to program it. With the right knowledge, the user can maximize the performance and power efficiency of the chip model.
In conclusion, the XCZU47DR-L2FFVG1517I chip model is an innovative and cost-effective product that is suitable for a wide range of applications. It has many advantages, such as high-speed processing, low power consumption, and scalability. The demand for the chip model is expected to continue to grow in the future, and it can be used to develop intelligent robots. To use the chip model effectively, certain technical talents are required.
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