XCZU47DR-L2FFVG1517I
XCZU47DR-L2FFVG1517I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU47DR-L2FFVG1517I


XCZU47DR-L2FFVG1517I
F20-XCZU47DR-L2FFVG1517I
Active
CMOS, FLIPCHIP-1517
FLIPCHIP-1517

XCZU47DR-L2FFVG1517I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU47DR-L2FFVG1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1517
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU47DR-L2FFVG1517I Datasheet Download


XCZU47DR-L2FFVG1517I Overview



The chip model XCZU47DR-L2FFVG1517I is an innovative product from Xilinx that is designed to provide robust performance and power efficiency. It is a high-performance, low-power, and cost-effective FPGA (Field Programmable Gate Array). It is suitable for a wide range of applications, from consumer electronics and automotive to industrial and medical applications.


The XCZU47DR-L2FFVG1517I chip model has many advantages, such as high-speed processing, low power consumption, and scalability. It is also capable of supporting multiple protocols, including PCIe, Ethernet, and USB. This makes the chip model an ideal choice for applications that require high-speed data processing and low power consumption.


In terms of industry trends, the demand for XCZU47DR-L2FFVG1517I is expected to continue to grow in the future. This is due to its cost-effectiveness, scalability, and high performance. Additionally, it is expected that the chip model will be used in more applications, including artificial intelligence (AI) and machine learning (ML).


The XCZU47DR-L2FFVG1517I chip model can be applied to the development and popularization of future intelligent robots. This is because the chip model is capable of supporting multiple protocols and has low power consumption. Furthermore, the chip model can be used to develop AI and ML applications, which are essential for the development of intelligent robots.


In order to use the XCZU47DR-L2FFVG1517I chip model effectively, certain technical talents are required. This includes knowledge of FPGA design, embedded systems, and AI/ML algorithms. Additionally, the user must have a good understanding of the chip model’s architecture and how to program it. With the right knowledge, the user can maximize the performance and power efficiency of the chip model.


In conclusion, the XCZU47DR-L2FFVG1517I chip model is an innovative and cost-effective product that is suitable for a wide range of applications. It has many advantages, such as high-speed processing, low power consumption, and scalability. The demand for the chip model is expected to continue to grow in the future, and it can be used to develop intelligent robots. To use the chip model effectively, certain technical talents are required.



5,915 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote