XCZU47DR-L1FSVG1517I
XCZU47DR-L1FSVG1517I
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rohs

AMD Xilinx

XCZU47DR-L1FSVG1517I


XCZU47DR-L1FSVG1517I
F20-XCZU47DR-L1FSVG1517I
Active
CMOS, FLIPCHIP-1517
FLIPCHIP-1517

XCZU47DR-L1FSVG1517I ECAD Model


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XCZU47DR-L1FSVG1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Package Description FLIPCHIP-1517
Date Of Intro 2019-02-20

XCZU47DR-L1FSVG1517I Datasheet Download


XCZU47DR-L1FSVG1517I Overview



The Xilinx XCZU47DR-L1FSVG1517I is a high-end chip model designed to meet the needs of the most advanced applications. It is a powerful, versatile, and cost-effective solution that can be used in a variety of industries.


The XCZU47DR-L1FSVG1517I chip model is based on the Xilinx Zynq UltraScale+ MPSoC family, which offers the highest performance and flexibility for the most advanced applications. It is equipped with a dual-core ARM Cortex-A53 processor, a Mali-400 MP2 GPU, and a wide range of peripherals. It also offers a variety of high-speed interfaces, such as USB 3.0, PCIe, and Gigabit Ethernet, allowing it to easily connect to a wide range of devices.


The XCZU47DR-L1FSVG1517I chip model also offers advanced features such as a high-performance FPGA fabric, a high-speed memory interface, and a wide range of I/O ports. It is capable of supporting the latest technologies, such as 5G, AI, and IoT. It is also designed for high-speed data processing and real-time data analysis.


In terms of industry trends, the XCZU47DR-L1FSVG1517I chip model is expected to be in high demand in the near future. This is due to its versatility and cost-effectiveness, as well as its ability to support the latest technologies. It can be used in a variety of industries, including automotive, industrial, medical, and consumer electronics.


In terms of product design, the XCZU47DR-L1FSVG1517I chip model is designed to meet the most stringent requirements. It offers a wide range of features, including a high-speed memory interface, a wide range of I/O ports, and advanced features such as a high-performance FPGA fabric. It also offers a wide range of peripherals, such as USB 3.0, PCIe, and Gigabit Ethernet, allowing it to easily connect to a wide range of devices.


When it comes to actual case studies, the XCZU47DR-L1FSVG1517I chip model has been used in a variety of applications, such as automotive, industrial, medical, and consumer electronics. It has been successfully used in applications such as automotive infotainment systems, industrial automation systems, medical imaging systems, and consumer electronics devices.


Finally, when using the XCZU47DR-L1FSVG1517I chip model, it is important to pay attention to certain precautions. For example, it is important to ensure that the chip model is compatible with the application environment, and that all necessary safety measures are taken. It is also important to ensure that the chip model is properly configured and that all necessary software and drivers are installed.


In conclusion, the XCZU47DR-L1FSVG1517I chip model is a powerful, versatile, and cost-effective solution that can be used in a variety of industries. It is designed to meet the most stringent requirements and is capable of supporting the latest technologies. It has been successfully used in a variety of applications, and it is expected to be in high demand in the near future. However, it is important to pay attention to certain precautions when using the chip model, such as ensuring compatibility with the application environment and taking all necessary safety measures.



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