
AMD Xilinx
XCZU47DR-L1FSVG1517I
XCZU47DR-L1FSVG1517I ECAD Model
XCZU47DR-L1FSVG1517I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Package Description | FLIPCHIP-1517 | |
Date Of Intro | 2019-02-20 |
XCZU47DR-L1FSVG1517I Datasheet Download
XCZU47DR-L1FSVG1517I Overview
The Xilinx XCZU47DR-L1FSVG1517I is a high-end chip model designed to meet the needs of the most advanced applications. It is a powerful, versatile, and cost-effective solution that can be used in a variety of industries.
The XCZU47DR-L1FSVG1517I chip model is based on the Xilinx Zynq UltraScale+ MPSoC family, which offers the highest performance and flexibility for the most advanced applications. It is equipped with a dual-core ARM Cortex-A53 processor, a Mali-400 MP2 GPU, and a wide range of peripherals. It also offers a variety of high-speed interfaces, such as USB 3.0, PCIe, and Gigabit Ethernet, allowing it to easily connect to a wide range of devices.
The XCZU47DR-L1FSVG1517I chip model also offers advanced features such as a high-performance FPGA fabric, a high-speed memory interface, and a wide range of I/O ports. It is capable of supporting the latest technologies, such as 5G, AI, and IoT. It is also designed for high-speed data processing and real-time data analysis.
In terms of industry trends, the XCZU47DR-L1FSVG1517I chip model is expected to be in high demand in the near future. This is due to its versatility and cost-effectiveness, as well as its ability to support the latest technologies. It can be used in a variety of industries, including automotive, industrial, medical, and consumer electronics.
In terms of product design, the XCZU47DR-L1FSVG1517I chip model is designed to meet the most stringent requirements. It offers a wide range of features, including a high-speed memory interface, a wide range of I/O ports, and advanced features such as a high-performance FPGA fabric. It also offers a wide range of peripherals, such as USB 3.0, PCIe, and Gigabit Ethernet, allowing it to easily connect to a wide range of devices.
When it comes to actual case studies, the XCZU47DR-L1FSVG1517I chip model has been used in a variety of applications, such as automotive, industrial, medical, and consumer electronics. It has been successfully used in applications such as automotive infotainment systems, industrial automation systems, medical imaging systems, and consumer electronics devices.
Finally, when using the XCZU47DR-L1FSVG1517I chip model, it is important to pay attention to certain precautions. For example, it is important to ensure that the chip model is compatible with the application environment, and that all necessary safety measures are taken. It is also important to ensure that the chip model is properly configured and that all necessary software and drivers are installed.
In conclusion, the XCZU47DR-L1FSVG1517I chip model is a powerful, versatile, and cost-effective solution that can be used in a variety of industries. It is designed to meet the most stringent requirements and is capable of supporting the latest technologies. It has been successfully used in a variety of applications, and it is expected to be in high demand in the near future. However, it is important to pay attention to certain precautions when using the chip model, such as ensuring compatibility with the application environment and taking all necessary safety measures.
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