AMD Xilinx
XCZU47DR-L1FFVG1517I
XCZU47DR-L1FFVG1517I ECAD Model
XCZU47DR-L1FFVG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-L1FFVG1517I Datasheet Download
XCZU47DR-L1FFVG1517I Overview
The XCZU47DR-L1FFVG1517I chip model is designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language to program and operate. This chip model has the capability to provide high-speed computing and processing power for a variety of applications.
The XCZU47DR-L1FFVG1517I chip model is designed to meet the current industry trends and can be used in a variety of markets. It is well suited for applications such as automation, machine vision, and industrial control. As technology advances, the chip model can be used in the development and popularization of future intelligent robots.
To use the XCZU47DR-L1FFVG1517I chip model effectively, technical talents with knowledge of HDL language are needed. Furthermore, the application environment may require the support of new technologies. It is important to be aware of the latest industry trends and technological advancements in order to ensure that the chip model is being used in the most effective way.
Overall, the XCZU47DR-L1FFVG1517I chip model is designed for high-performance digital signal processing, embedded processing, and image processing. It is well suited for a variety of applications and can be used in the development and popularization of future intelligent robots. Technical talents with knowledge of HDL language are needed to use the chip model effectively and to ensure that the application environment is supported by new technologies.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||