XCZU47DR-2FSVG1517E
XCZU47DR-2FSVG1517E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU47DR-2FSVG1517E


XCZU47DR-2FSVG1517E
F20-XCZU47DR-2FSVG1517E
Active
CMOS, FLIPCHIP-1517
FLIPCHIP-1517

XCZU47DR-2FSVG1517E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU47DR-2FSVG1517E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1517
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU47DR-2FSVG1517E Datasheet Download


XCZU47DR-2FSVG1517E Overview



The XCZU47DR-2FSVG1517E chip model is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. This chip requires the use of HDL language to program and configure, making it an ideal choice for those who require a powerful and versatile chip for their projects.


The XCZU47DR-2FSVG1517E chip is designed to meet the needs of the most demanding digital signal processing applications. It features a high-performance processor core, a wide range of peripherals, and a variety of memory options. This makes it a great choice for projects that require a powerful and versatile chip.


The industry trends and future development of related industries are determined by the specific technologies that are needed for the application environment. For example, if a project requires new technologies such as artificial intelligence, then the chip model XCZU47DR-2FSVG1517E may need to be adapted to support these new technologies.


The product description and design requirements of the XCZU47DR-2FSVG1517E chip can be found in the official documentation. This includes information on the chip's architecture, its peripherals, and its memory options. This documentation also includes case studies and design tips to help users get the most out of the chip.


In conclusion, the XCZU47DR-2FSVG1517E chip model is an ideal choice for those who require a powerful and versatile chip for their projects. It is designed to meet the needs of the most demanding digital signal processing applications, and can be adapted to support new technologies if needed. The product description and design requirements of the chip can be found in the official documentation, along with case studies and design tips to help users get the most out of the chip.



4,777 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote