AMD Xilinx
XCZU47DR-1FSVG1517I
XCZU47DR-1FSVG1517I ECAD Model
XCZU47DR-1FSVG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU47DR-1FSVG1517I Datasheet Download
XCZU47DR-1FSVG1517I Overview
The XCZU47DR-1FSVG1517I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be able to handle complex tasks and process large amounts of data quickly and reliably. The chip model is programmed with a HDL language, which allows for greater flexibility and control when programming.
The XCZU47DR-1FSVG1517I chip model offers a number of advantages over other chip models. It is capable of processing data at speeds up to 1.5GHz, making it ideal for applications that require high-performance processing. It also has a low power consumption, which is beneficial for battery-powered applications. Additionally, the chip model is designed to be modular, allowing for future upgrades and customization.
The XCZU47DR-1FSVG1517I chip model is expected to be in high demand in the near future. This is due to the increasing need for high-performance digital signal processing and embedded processing in a variety of industries. The chip model is also well suited for applications in advanced communication systems, which are becoming increasingly important in today’s world.
The XCZU47DR-1FSVG1517I chip model was designed with future upgrades in mind. It is capable of being upgraded to handle more complex tasks and process larger amounts of data. Additionally, it can be used in advanced communication systems, making it a versatile tool for many different applications. With its high-performance capabilities and low power consumption, the XCZU47DR-1FSVG1517I chip model is sure to be in high demand in the near future.
You May Also Be Interested In
3,009 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||