XCZU47DR-1FSVG1517E
XCZU47DR-1FSVG1517E
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rohs

AMD Xilinx

XCZU47DR-1FSVG1517E


XCZU47DR-1FSVG1517E
F20-XCZU47DR-1FSVG1517E
Active
CMOS, FLIPCHIP-1517
FLIPCHIP-1517

XCZU47DR-1FSVG1517E ECAD Model


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XCZU47DR-1FSVG1517E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1517
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU47DR-1FSVG1517E Datasheet Download


XCZU47DR-1FSVG1517E Overview



The chip model XCZU47DR-1FSVG1517E is a cutting-edge semiconductor device that has been designed to meet the needs of the modern technology industry. This chip is a high-performance, low-power device that is suitable for a wide range of applications in the field of networking and computing. It has been designed to provide the highest levels of performance and power efficiency, which is essential for the current and future demands of the industry.


The chip model XCZU47DR-1FSVG1517E is a part of the Xilinx UltraScale+ family of FPGAs and is the latest generation of the Xilinx Zynq UltraScale+ devices. It is designed to provide the highest levels of performance and power efficiency, making it suitable for a wide range of applications in the field of networking and computing. This chip model is capable of providing up to 28 Gbps of bandwidth, making it ideal for high-speed networking and computing applications. It also supports the latest technologies, such as PCIe Gen 4, USB 3.0, and DDR4 memory.


The chip model XCZU47DR-1FSVG1517E is designed with a range of features that make it suitable for a variety of applications. It is capable of supporting multiple operating systems, including Linux, Windows, and Android. It can also be used for a variety of applications, such as machine learning, artificial intelligence, and virtualization. It is also capable of providing high levels of performance and power efficiency, making it suitable for a variety of use cases.


In addition to the chip model XCZU47DR-1FSVG1517E, there are a variety of other products in the Xilinx UltraScale+ family that can be used for a variety of applications. These products include the Xilinx Zynq UltraScale+ MPSoC and the Xilinx Zynq UltraScale+ RFSoC. These products are designed to provide the highest levels of performance and power efficiency, making them suitable for a wide range of applications.


The chip model XCZU47DR-1FSVG1517E is designed to provide the highest levels of performance and power efficiency, making it suitable for a wide range of applications. It is capable of supporting the latest technologies, such as PCIe Gen 4, USB 3.0, and DDR4 memory. In addition, it is capable of providing up to 28 Gbps of bandwidth, making it ideal for high-speed networking and computing applications. It is also designed to support multiple operating systems, including Linux, Windows, and Android, making it suitable for a variety of use cases.


As for the future development of the chip model XCZU47DR-1FSVG1517E, it is likely to be used in a variety of intelligent scenarios. It is possible that it will be used in the era of fully intelligent systems, such as self-driving cars, autonomous robots, and intelligent home appliances. It is also likely to be used in a variety of networking applications, such as 5G networks, high-speed data centers, and cloud computing.


In order to ensure the successful application of the chip model XCZU47DR-1FSVG1517E, it is important to consider the product description and specific design requirements. It is also important to consider the actual case studies and precautions that should be taken when using the device. It is also important to consider the industry trends and the potential applications of the device in order to ensure that the device is suitable for the current and future demands of the industry.



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