AMD Xilinx
XCZU46DR-L2FFVH1760I
XCZU46DR-L2FFVH1760I ECAD Model
XCZU46DR-L2FFVH1760I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU46DR-L2FFVH1760I Datasheet Download
XCZU46DR-L2FFVH1760I Overview
The XCZU46DR-L2FFVH1760I chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to handle complex and computationally intensive tasks, such as machine learning, artificial intelligence, and deep learning. The chip model is built on a 16nm FinFET process and utilizes the latest Xilinx UltraScale+ architecture, which provides a comprehensive set of features for high-performance computing and signal processing. The chip model is also equipped with a variety of peripherals, such as DDR4 memory, PCIe Gen3, USB3.0, and Gigabit Ethernet, to enable easy integration with other components.
The XCZU46DR-L2FFVH1760I chip model is programmed using the HDL language, which allows for efficient and precise control of the processor. This allows for fast and efficient development of applications for the chip model, as well as for the integration of existing applications into the chip model. The HDL language also allows for easy debugging of applications, making it easier to identify and fix any errors or bugs.
The XCZU46DR-L2FFVH1760I chip model is an excellent choice for those who require high-performance digital signal processing, embedded processing, and image processing. The chip model offers a wide range of features and capabilities, making it suitable for a variety of applications. It is also designed to be highly scalable, allowing for future upgrades and expansions.
The XCZU46DR-L2FFVH1760I chip model is also suitable for advanced communication systems, such as 5G networks. The chip model is capable of handling high-bandwidth data transfers, making it an ideal choice for 5G networks. Its scalability and programmability also make it suitable for future upgrades and expansions.
The XCZU46DR-L2FFVH1760I chip model is an excellent choice for those who require high-performance digital signal processing, embedded processing, and image processing. It offers a wide range of features and capabilities, making it suitable for a variety of applications. It is also designed to be highly scalable, allowing for future upgrades and expansions. The chip model is also suitable for advanced communication systems, such as 5G networks, making it an ideal choice for those who require high-bandwidth data transfers. With its scalability and programmability, the XCZU46DR-L2FFVH1760I chip model is expected to be in high demand in the future.
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| QTY | Unit Price | Ext Price |
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| No reference price found. | ||