
AMD Xilinx
XCZU3EG-3SFVC784E
XCZU3EG-3SFVC784E ECAD Model
XCZU3EG-3SFVC784E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Temperature Grade | OTHER | |
JESD-30 Code | S-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 |
XCZU3EG-3SFVC784E Datasheet Download
XCZU3EG-3SFVC784E Overview
The chip model XCZU3EG-3SFVC784E is a cutting-edge product in the semiconductor industry, designed to meet the needs of modern networks and intelligent applications. With its advanced features and capabilities, this model is set to revolutionize the way we interact with technology.
In terms of industry trends, the chip model XCZU3EG-3SFVC784E is a high-performance, low-power solution that is built to support the needs of the modern network and intelligent system. It is capable of handling large amounts of data at high speeds, making it an ideal choice for applications that require high throughput. It also features advanced security features, making it a great choice for applications that require secure communication.
The future development of related industries will depend on the specific technologies needed for the application environment. For example, if the application requires support for artificial intelligence, then the chip model XCZU3EG-3SFVC784E will be able to provide the necessary support. Similarly, if the application requires support for the Internet of Things, then the chip model XCZU3EG-3SFVC784E will be able to provide the necessary support.
In terms of possible future applications, the chip model XCZU3EG-3SFVC784E can be used in a variety of intelligent scenarios. For example, it can be used in autonomous vehicles, smart homes, and intelligent manufacturing systems. It can also be used in the era of fully intelligent systems, such as in the development of artificial intelligence and machine learning.
In terms of product description and design requirements, the chip model XCZU3EG-3SFVC784E is a high-performance, low-power solution that is built to support the needs of the modern network and intelligent system. It is capable of handling large amounts of data at high speeds, making it an ideal choice for applications that require high throughput. It also features advanced security features, making it a great choice for applications that require secure communication.
In terms of actual case studies, the chip model XCZU3EG-3SFVC784E has been used in a variety of applications, from autonomous vehicles to smart home systems. In each case, the chip model XCZU3EG-3SFVC784E has been able to provide the necessary support for the application, providing high performance and reliable communication.
Finally, in terms of precautions, the chip model XCZU3EG-3SFVC784E should be used with caution and in accordance with the manufacturer's instructions. It is important to ensure that the chip model is compatible with the application and that it is properly configured and maintained. Additionally, it is important to ensure that the chip model is not exposed to extreme temperatures or other environmental conditions that could potentially damage the chip.
In conclusion, the chip model XCZU3EG-3SFVC784E is a cutting-edge product in the semiconductor industry, designed to meet the needs of modern networks and intelligent applications. With its advanced features and capabilities, this model is set to revolutionize the way we interact with technology. Its possible future applications, product description and design requirements, as well as actual case studies and precautions should all be taken into consideration when deciding whether or not to use the chip model XCZU3EG-3SFVC784E.
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1,160 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $632.5488 | $632.5488 |
10+ | $625.7472 | $6,257.4720 |
100+ | $591.7392 | $59,173.9200 |
1000+ | $557.7312 | $278,865.6000 |
10000+ | $510.1200 | $510,120.0000 |
The price is for reference only, please refer to the actual quotation! |