XCZU3EG-3SFVC784E
XCZU3EG-3SFVC784E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU3EG-3SFVC784E


XCZU3EG-3SFVC784E
F20-XCZU3EG-3SFVC784E
Active
CMOS, BGA
BGA

XCZU3EG-3SFVC784E ECAD Model


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XCZU3EG-3SFVC784E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade OTHER
JESD-30 Code S-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.31.00.01

XCZU3EG-3SFVC784E Datasheet Download


XCZU3EG-3SFVC784E Overview



The chip model XCZU3EG-3SFVC784E is a cutting-edge product in the semiconductor industry, designed to meet the needs of modern networks and intelligent applications. With its advanced features and capabilities, this model is set to revolutionize the way we interact with technology.


In terms of industry trends, the chip model XCZU3EG-3SFVC784E is a high-performance, low-power solution that is built to support the needs of the modern network and intelligent system. It is capable of handling large amounts of data at high speeds, making it an ideal choice for applications that require high throughput. It also features advanced security features, making it a great choice for applications that require secure communication.


The future development of related industries will depend on the specific technologies needed for the application environment. For example, if the application requires support for artificial intelligence, then the chip model XCZU3EG-3SFVC784E will be able to provide the necessary support. Similarly, if the application requires support for the Internet of Things, then the chip model XCZU3EG-3SFVC784E will be able to provide the necessary support.


In terms of possible future applications, the chip model XCZU3EG-3SFVC784E can be used in a variety of intelligent scenarios. For example, it can be used in autonomous vehicles, smart homes, and intelligent manufacturing systems. It can also be used in the era of fully intelligent systems, such as in the development of artificial intelligence and machine learning.


In terms of product description and design requirements, the chip model XCZU3EG-3SFVC784E is a high-performance, low-power solution that is built to support the needs of the modern network and intelligent system. It is capable of handling large amounts of data at high speeds, making it an ideal choice for applications that require high throughput. It also features advanced security features, making it a great choice for applications that require secure communication.


In terms of actual case studies, the chip model XCZU3EG-3SFVC784E has been used in a variety of applications, from autonomous vehicles to smart home systems. In each case, the chip model XCZU3EG-3SFVC784E has been able to provide the necessary support for the application, providing high performance and reliable communication.


Finally, in terms of precautions, the chip model XCZU3EG-3SFVC784E should be used with caution and in accordance with the manufacturer's instructions. It is important to ensure that the chip model is compatible with the application and that it is properly configured and maintained. Additionally, it is important to ensure that the chip model is not exposed to extreme temperatures or other environmental conditions that could potentially damage the chip.


In conclusion, the chip model XCZU3EG-3SFVC784E is a cutting-edge product in the semiconductor industry, designed to meet the needs of modern networks and intelligent applications. With its advanced features and capabilities, this model is set to revolutionize the way we interact with technology. Its possible future applications, product description and design requirements, as well as actual case studies and precautions should all be taken into consideration when deciding whether or not to use the chip model XCZU3EG-3SFVC784E.



1,160 In Stock


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Unit Price: $680.16
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $632.5488 $632.5488
10+ $625.7472 $6,257.4720
100+ $591.7392 $59,173.9200
1000+ $557.7312 $278,865.6000
10000+ $510.1200 $510,120.0000
The price is for reference only, please refer to the actual quotation!

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