XCZU3EG-2SFVC784E
XCZU3EG-2SFVC784E
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rohs

AMD Xilinx

XCZU3EG-2SFVC784E


XCZU3EG-2SFVC784E
F20-XCZU3EG-2SFVC784E
Active
CMOS, FBGA, BGA78428X28,32
FBGA, BGA78428X28,32

XCZU3EG-2SFVC784E ECAD Model


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XCZU3EG-2SFVC784E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade OTHER
JESD-30 Code S-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 3.32 mm
Width 23 mm
Length 23 mm
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA78428X28,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2017-02-15

XCZU3EG-2SFVC784E Datasheet Download


XCZU3EG-2SFVC784E Overview



The XCZU3EG-2SFVC784E chip model is a powerful and versatile device that can be used in a wide range of applications. This chip model is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is a reliable and cost-effective solution for many applications.


The XCZU3EG-2SFVC784E chip model is a great choice for networking applications. With its high-performance processing capabilities, it can be used to create intelligent networks that can process data quickly and accurately. It is also suitable for applications that require real-time data processing, such as video streaming and autonomous vehicle control. In the era of fully intelligent systems, the XCZU3EG-2SFVC784E chip model can be used to create smart systems that can process data in real-time and make decisions based on the data.


When designing a product using the XCZU3EG-2SFVC784E chip model, it is important to consider the specific design requirements of the product. It is also important to consider the actual case studies and precautions that should be taken when using the chip model. For example, it is important to consider the power consumption of the chip model, as well as the thermal management of the product. Additionally, it is important to consider the clock speed and the memory requirements of the product.


In conclusion, the XCZU3EG-2SFVC784E chip model is a powerful and versatile device that can be used in a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also a great choice for networking applications and can be used to create intelligent networks. When designing a product using the XCZU3EG-2SFVC784E chip model, it is important to consider the specific design requirements of the product, as well as actual case studies and precautions that should be taken.



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Unit Price: $488.80
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $454.5840 $454.5840
10+ $449.6960 $4,496.9600
100+ $425.2560 $42,525.6000
1000+ $400.8160 $200,408.0000
10000+ $366.6000 $366,600.0000
The price is for reference only, please refer to the actual quotation!

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