
AMD Xilinx
XCZU3EG-2SFVC784E
XCZU3EG-2SFVC784E ECAD Model
XCZU3EG-2SFVC784E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Temperature Grade | OTHER | |
JESD-30 Code | S-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.32 mm | |
Width | 23 mm | |
Length | 23 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA, BGA78428X28,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCZU3EG-2SFVC784E Datasheet Download
XCZU3EG-2SFVC784E Overview
The XCZU3EG-2SFVC784E chip model is a powerful and versatile device that can be used in a wide range of applications. This chip model is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is a reliable and cost-effective solution for many applications.
The XCZU3EG-2SFVC784E chip model is a great choice for networking applications. With its high-performance processing capabilities, it can be used to create intelligent networks that can process data quickly and accurately. It is also suitable for applications that require real-time data processing, such as video streaming and autonomous vehicle control. In the era of fully intelligent systems, the XCZU3EG-2SFVC784E chip model can be used to create smart systems that can process data in real-time and make decisions based on the data.
When designing a product using the XCZU3EG-2SFVC784E chip model, it is important to consider the specific design requirements of the product. It is also important to consider the actual case studies and precautions that should be taken when using the chip model. For example, it is important to consider the power consumption of the chip model, as well as the thermal management of the product. Additionally, it is important to consider the clock speed and the memory requirements of the product.
In conclusion, the XCZU3EG-2SFVC784E chip model is a powerful and versatile device that can be used in a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also a great choice for networking applications and can be used to create intelligent networks. When designing a product using the XCZU3EG-2SFVC784E chip model, it is important to consider the specific design requirements of the product, as well as actual case studies and precautions that should be taken.
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1,569 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $454.5840 | $454.5840 |
10+ | $449.6960 | $4,496.9600 |
100+ | $425.2560 | $42,525.6000 |
1000+ | $400.8160 | $200,408.0000 |
10000+ | $366.6000 | $366,600.0000 |
The price is for reference only, please refer to the actual quotation! |