XCZU3CG-L1SBVA484I
XCZU3CG-L1SBVA484I
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rohs

AMD Xilinx

XCZU3CG-L1SBVA484I


XCZU3CG-L1SBVA484I
F20-XCZU3CG-L1SBVA484I
Active
CMOS, FBGA, BGA484,22X22,32
FBGA, BGA484,22X22,32

XCZU3CG-L1SBVA484I ECAD Model


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XCZU3CG-L1SBVA484I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B484
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA484,22X22,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU3CG-L1SBVA484I Datasheet Download


XCZU3CG-L1SBVA484I Overview



The XCZU3CG-L1SBVA484I chip model is a new generation of advanced, high-performance FPGA chip designed and developed by Xilinx. It is an ideal choice for applications that require high-speed processing, low-power consumption and high reliability. It has a wide range of applications in the fields of machine vision, industrial automation, network security, automotive, medical, aerospace and other industries.


The XCZU3CG-L1SBVA484I chip model has many advantages, such as low power consumption, high performance, high reliability and low cost. It can be used in various applications, including machine vision, industrial automation, network security, automotive, medical, aerospace and other industries. It is also suitable for applications that require high-speed processing and low-power consumption.


The demand for the XCZU3CG-L1SBVA484I chip model is expected to increase in the future, as more and more industries are looking for high-performance, low-power and reliable chips for their applications. In the field of machine vision, the chip model can be used for image recognition and object tracking, as well as for intelligent video surveillance. In the field of industrial automation, the chip model can be used for machine control and data acquisition. In the field of network security, the chip model can be used for network intrusion detection and prevention.


In the future, the XCZU3CG-L1SBVA484I chip model can be applied to various intelligent scenarios such as autonomous driving, facial recognition and natural language processing. It is also possible to be used in the era of fully intelligent systems, such as smart home and smart city. In addition, the chip model can also be used for the development and popularization of future intelligent robots, such as humanoid robots and service robots.


In order to use the XCZU3CG-L1SBVA484I chip model effectively, technical talents such as software engineers and hardware engineers are needed. They should have knowledge of hardware design, software programming and system integration. In addition, they should also have experience in working with FPGA chips and other related technologies. With the right combination of technical skills, the chip model can be used to create innovative and powerful solutions for various applications.



2,090 In Stock


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Unit Price: $1,654.9126
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,539.0687 $1,539.0687
10+ $1,522.5196 $15,225.1959
100+ $1,439.7740 $143,977.3962
1000+ $1,357.0283 $678,514.1660
10000+ $1,241.1845 $1,241,184.4500
The price is for reference only, please refer to the actual quotation!

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