AMD Xilinx
XCZU3CG-1SFVC784I
XCZU3CG-1SFVC784I ECAD Model
XCZU3CG-1SFVC784I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA, BGA78428X28,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU3CG-1SFVC784I Datasheet Download
XCZU3CG-1SFVC784I Overview
The XCZU3CG-1SFVC784I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) and is suitable for a variety of applications. It has a high-performance architecture which allows it to be used in a variety of scenarios, such as high-performance computing, artificial intelligence, and machine learning.
The original design intention of the XCZU3CG-1SFVC784I chip model was to provide a powerful platform for digital signal processing, embedded processing, and image processing. It was designed to be used with HDL and its architecture was designed to be easily upgradable. This means that the chip model can be upgraded in the future to provide a more powerful platform for these applications.
In terms of its potential applications, the XCZU3CG-1SFVC784I chip model can be used in advanced communication systems. It has the ability to process large amounts of data quickly and efficiently, making it suitable for a variety of network applications. In addition, it can be used in intelligent scenarios such as artificial intelligence and machine learning. This makes it a great tool for the development of intelligent systems.
The XCZU3CG-1SFVC784I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL and its architecture is designed to be easily upgradable. This makes it suitable for a variety of applications, including advanced communication systems, artificial intelligence, and machine learning. It is a great tool for the development of intelligent systems in the era of fully intelligent systems.
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2,084 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $284.7413 | $284.7413 |
| 10+ | $281.6795 | $2,816.7953 |
| 100+ | $266.3709 | $26,637.0858 |
| 1000+ | $251.0622 | $125,531.0940 |
| 10000+ | $229.6301 | $229,630.0500 |
| The price is for reference only, please refer to the actual quotation! | ||