AMD Xilinx
XCZU3CG-1SFVC784E
XCZU3CG-1SFVC784E ECAD Model
XCZU3CG-1SFVC784E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| JESD-30 Code | S-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA, BGA78428X28,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU3CG-1SFVC784E Datasheet Download
XCZU3CG-1SFVC784E Overview
The chip model XCZU3CG-1SFVC784E is a high-performance digital signal processing, embedded processing, and image processing solution. It is designed to be used with the HDL language, allowing for faster and more efficient development of applications. With its advanced features and capabilities, the chip model XCZU3CG-1SFVC784E is ideal for use in a variety of industries.
The industry trends of the chip model XCZU3CG-1SFVC784E and the future development of related industries depend on the specific technologies that are needed. As technology continues to evolve, new and improved technologies will be needed to keep up with the ever-changing demands of the market. This could include new technologies such as artificial intelligence, machine learning, and the Internet of Things.
The original design intention of the chip model XCZU3CG-1SFVC784E was to provide users with a powerful and reliable solution for their digital signal processing, embedded processing, and image processing needs. It was also designed to be easily upgradable, allowing users to easily incorporate new features and capabilities into their applications. This could include advanced communication systems, such as 5G and Wi-Fi 6, which would require the chip model XCZU3CG-1SFVC784E to be upgraded in order to be compatible.
Overall, the chip model XCZU3CG-1SFVC784E is an excellent solution for users who are looking for a high-performance digital signal processing, embedded processing, and image processing solution. With its advanced features and capabilities, it is suitable for a variety of industries and can be easily upgraded to keep up with new technologies as they become available.
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3,544 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $194.1102 | $194.1102 |
| 10+ | $192.0230 | $1,920.2295 |
| 100+ | $181.5869 | $18,158.6922 |
| 1000+ | $171.1509 | $85,575.4460 |
| 10000+ | $156.5405 | $156,540.4500 |
| The price is for reference only, please refer to the actual quotation! | ||