
AMD Xilinx
XCZU3CG-1SFVA625I
XCZU3CG-1SFVA625I ECAD Model
XCZU3CG-1SFVA625I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B625 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 625 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA, BGA625,25X25,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU3CG-1SFVA625I Datasheet Download
XCZU3CG-1SFVA625I Overview
The XCZU3CG-1SFVA625I chip model is a high-performance, low-power system-on-chip (SoC) designed for digital signal processing, embedded processing, and image processing applications. It is based on the Xilinx UltraScale+ architecture and is programmed in the HDL language. The chip model has several advantages, including high performance, low power consumption, and a wide range of applications.
The XCZU3CG-1SFVA625I chip model is expected to be in greater demand in the future due to its ability to handle complex tasks and its low power consumption. It is expected to be used in a wide range of industries, from automotive to medical to consumer electronics, as well as in industrial automation and robotics. As the demand for the chip model increases, the potential applications of the chip model will also expand.
The XCZU3CG-1SFVA625I chip model is expected to be used in networks and intelligent scenarios in the future. It is expected to be used in 5G networks, as well as in the development of autonomous vehicles, intelligent robots, and smart home systems. The chip model is also expected to be used in the era of fully intelligent systems, such as artificial intelligence, machine learning, and deep learning.
In summary, the XCZU3CG-1SFVA625I chip model is a high-performance, low-power SoC designed for digital signal processing, embedded processing, and image processing applications. It is expected to be in greater demand in the future due to its ability to handle complex tasks and its low power consumption. The chip model is expected to be used in networks and intelligent scenarios in the future, as well as in the era of fully intelligent systems.
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1,698 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $336.5856 | $336.5856 |
10+ | $332.9664 | $3,329.6640 |
100+ | $314.8704 | $31,487.0400 |
1000+ | $296.7744 | $148,387.2000 |
10000+ | $271.4400 | $271,440.0000 |
The price is for reference only, please refer to the actual quotation! |