XCZU3CG-1SFVA625I
XCZU3CG-1SFVA625I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU3CG-1SFVA625I


XCZU3CG-1SFVA625I
F20-XCZU3CG-1SFVA625I
Active
CMOS, FBGA, BGA625,25X25,32
FBGA, BGA625,25X25,32

XCZU3CG-1SFVA625I ECAD Model


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XCZU3CG-1SFVA625I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B625
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 625
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA625,25X25,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU3CG-1SFVA625I Datasheet Download


XCZU3CG-1SFVA625I Overview



The XCZU3CG-1SFVA625I chip model is a high-performance, low-power system-on-chip (SoC) designed for digital signal processing, embedded processing, and image processing applications. It is based on the Xilinx UltraScale+ architecture and is programmed in the HDL language. The chip model has several advantages, including high performance, low power consumption, and a wide range of applications.


The XCZU3CG-1SFVA625I chip model is expected to be in greater demand in the future due to its ability to handle complex tasks and its low power consumption. It is expected to be used in a wide range of industries, from automotive to medical to consumer electronics, as well as in industrial automation and robotics. As the demand for the chip model increases, the potential applications of the chip model will also expand.


The XCZU3CG-1SFVA625I chip model is expected to be used in networks and intelligent scenarios in the future. It is expected to be used in 5G networks, as well as in the development of autonomous vehicles, intelligent robots, and smart home systems. The chip model is also expected to be used in the era of fully intelligent systems, such as artificial intelligence, machine learning, and deep learning.


In summary, the XCZU3CG-1SFVA625I chip model is a high-performance, low-power SoC designed for digital signal processing, embedded processing, and image processing applications. It is expected to be in greater demand in the future due to its ability to handle complex tasks and its low power consumption. The chip model is expected to be used in networks and intelligent scenarios in the future, as well as in the era of fully intelligent systems.



1,698 In Stock


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Unit Price: $361.92
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $336.5856 $336.5856
10+ $332.9664 $3,329.6640
100+ $314.8704 $31,487.0400
1000+ $296.7744 $148,387.2000
10000+ $271.4400 $271,440.0000
The price is for reference only, please refer to the actual quotation!

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