AMD Xilinx
XCZU3CG-1SFVA625E
XCZU3CG-1SFVA625E ECAD Model
XCZU3CG-1SFVA625E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 625 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA, BGA625,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU3CG-1SFVA625E Datasheet Download
XCZU3CG-1SFVA625E Overview
The chip model XCZU3CG-1SFVA625E is a powerful and advanced device that has been developed with the intention of providing a platform for a wide range of applications. It is a high-performance, low-power FPGA (Field Programmable Gate Array) that is capable of supporting a variety of technologies, such as Ethernet, USB and PCIe. It is designed to enable developers to create and deploy applications quickly and efficiently.
The chip model XCZU3CG-1SFVA625E has several advantages compared to other FPGAs. It has an integrated high-speed transceiver that allows for data transfer at up to 12.5 Gbps, and it is also capable of supporting up to 18,000 logic cells. This makes it an ideal choice for applications that require high-speed data transfer and complex logic functions. In addition, it has a wide range of features, such as a powerful DSP (Digital Signal Processor) and a dedicated memory interface.
The demand for the chip model XCZU3CG-1SFVA625E is expected to increase in the future. This is due to its ability to support a wide range of technologies, such as Ethernet, USB and PCIe, as well as its ability to process complex logic functions. It is also expected to be used in a variety of applications, such as industrial automation, data centers, and communication systems.
The original design intention of the chip model XCZU3CG-1SFVA625E was to provide a platform that could be used for a wide range of applications. It is capable of supporting a variety of technologies, such as Ethernet, USB and PCIe, and it is also capable of processing complex logic functions. The chip model is also capable of supporting future upgrades, and it can be used in advanced communication systems.
Overall, the chip model XCZU3CG-1SFVA625E is a powerful and advanced device that is capable of supporting a wide range of technologies and applications. It is expected to have increasing demand in the future, and it can be used in advanced communication systems. It is designed to enable developers to create and deploy applications quickly and efficiently, and it has the potential to be upgraded in the future.
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1,416 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $184.2230 | $184.2230 |
| 10+ | $182.2422 | $1,822.4216 |
| 100+ | $172.3377 | $17,233.7691 |
| 1000+ | $162.4332 | $81,216.6130 |
| 10000+ | $148.5670 | $148,566.9750 |
| The price is for reference only, please refer to the actual quotation! | ||