AMD Xilinx
XCZU2EG-3SFVC784E
XCZU2EG-3SFVC784E ECAD Model
XCZU2EG-3SFVC784E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| JESD-30 Code | S-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 |
XCZU2EG-3SFVC784E Datasheet Download
XCZU2EG-3SFVC784E Overview
The chip model XCZU2EG-3SFVC784E is a high-performance chip designed for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language, which is a hardware description language used to define and describe the behavior of hardware. This chip is designed to provide high performance computing capabilities and is suitable for a wide range of applications.
The chip model XCZU2EG-3SFVC784E is designed to meet the needs of the industry and keep up with the latest trends. It is designed to be able to take advantage of the latest technologies and advancements in the field. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.
The original design intention of the chip model XCZU2EG-3SFVC784E was to provide a powerful and reliable chip for digital signal processing, embedded processing, image processing, and other applications. It is designed to be able to take advantage of the latest technologies and advancements in the field. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.
The chip model XCZU2EG-3SFVC784E is designed to provide high performance computing capabilities and is suitable for a wide range of applications. It is designed to meet the needs of the industry and keep up with the latest trends. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.
In conclusion, the chip model XCZU2EG-3SFVC784E is a powerful and reliable chip designed for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language, which is a hardware description language used to define and describe the behavior of hardware. It is designed to meet the needs of the industry and keep up with the latest trends. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.
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3,492 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $405.2568 | $405.2568 |
| 10+ | $400.8992 | $4,008.9920 |
| 100+ | $379.1112 | $37,911.1200 |
| 1000+ | $357.3232 | $178,661.6000 |
| 10000+ | $326.8200 | $326,820.0000 |
| The price is for reference only, please refer to the actual quotation! | ||