AMD Xilinx
XCZU2CG-2SFVA625E
XCZU2CG-2SFVA625E ECAD Model
XCZU2CG-2SFVA625E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 625 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.43 mm | |
| Width | 21 mm | |
| Length | 21 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA, BGA625,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU2CG-2SFVA625E Datasheet Download
XCZU2CG-2SFVA625E Overview
The XCZU2CG-2SFVA625E chip model is a powerful and advanced model that has been developed to meet the increasing demand for efficient and high-performance computing solutions. This chip model is based on the latest Xilinx Zynq UltraScale+ MPSoC architecture and is designed to meet the needs of the most demanding applications. It offers a high-speed and low-power solution for applications such as embedded systems, industrial automation, network security, machine learning, and artificial intelligence.
The XCZU2CG-2SFVA625E chip model has a wide range of features that make it suitable for a variety of applications. It is equipped with a 64-bit quad-core ARM Cortex-A53 processor, a Mali-400 MP2 GPU, and an FPGA fabric with up to 4,800 DSP slices. It also supports a range of high-speed interfaces such as PCIe, USB, and Ethernet. In addition, it is designed with an advanced power management system that allows for efficient power consumption and improved performance.
In terms of industry trends, the XCZU2CG-2SFVA625E chip model is expected to be in high demand in the coming years. This is due to its ability to meet the needs of a wide range of applications such as embedded systems, industrial automation, network security, machine learning, and artificial intelligence. Furthermore, the chip model is also expected to be used in the development of fully intelligent systems as it is capable of supporting the latest technologies such as 5G and Wi-Fi 6.
As for the future applications of the XCZU2CG-2SFVA625E chip model, it is expected to be used in a variety of networks and intelligent scenarios. For example, it can be used in the development of autonomous vehicles, smart cities, and the Internet of Things. In addition, it can also be used in the development of advanced robotics and AI-based systems.
Overall, the XCZU2CG-2SFVA625E chip model is a powerful and advanced model that is designed to meet the needs of the most demanding applications. It is expected to be in high demand in the coming years due to its ability to support a wide range of technologies and applications. Furthermore, it is also expected to be used in the development of fully intelligent systems and a variety of networks and intelligent scenarios.
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4,656 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $235.9968 | $235.9968 |
| 10+ | $233.4592 | $2,334.5920 |
| 100+ | $220.7712 | $22,077.1200 |
| 1000+ | $208.0832 | $104,041.6000 |
| 10000+ | $190.3200 | $190,320.0000 |
| The price is for reference only, please refer to the actual quotation! | ||