XCZU2CG-1SFVA625E
XCZU2CG-1SFVA625E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU2CG-1SFVA625E


XCZU2CG-1SFVA625E
F20-XCZU2CG-1SFVA625E
Active
CMOS, FBGA, BGA625,25X25,32
FBGA, BGA625,25X25,32

XCZU2CG-1SFVA625E ECAD Model


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XCZU2CG-1SFVA625E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B625
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 625
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA625,25X25,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU2CG-1SFVA625E Datasheet Download


XCZU2CG-1SFVA625E Overview



The XCZU2CG-1SFVA625E chip model is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the HDL (Hardware Description Language) language, which is a powerful tool used to create hardware designs. The chip model is well-suited to these applications due to its high speed and low power consumption.


The industry trends of the XCZU2CG-1SFVA625E chip model and the future development of related industries will depend on the specific technologies needed. It is possible that the application environment may require the support of new technologies in order to take advantage of the chip model's capabilities.


The original design intention of the XCZU2CG-1SFVA625E chip model was to provide a powerful and versatile solution for digital signal processing, embedded processing, and image processing. Its design was also intended to be easily upgradable, allowing for future improvements and capabilities. The chip model is also capable of being used in advanced communication systems, such as 5G networks, as well as other data-intensive applications.


Overall, the XCZU2CG-1SFVA625E chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the HDL language, and is easily upgradable for future improvements and capabilities. The chip model is also capable of being used in advanced communication systems, such as 5G networks, as well as other data-intensive applications. As the industry evolves and new technologies are developed, the XCZU2CG-1SFVA625E chip model will remain a viable solution for these applications.



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Unit Price: $78.262
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $72.7837 $72.7837
10+ $72.0010 $720.0104
100+ $68.0879 $6,808.7940
1000+ $64.1748 $32,087.4200
10000+ $58.6965 $58,696.5000
The price is for reference only, please refer to the actual quotation!

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