
AMD Xilinx
XCZU2CG-1SFVA625E
XCZU2CG-1SFVA625E ECAD Model
XCZU2CG-1SFVA625E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B625 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 625 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA, BGA625,25X25,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU2CG-1SFVA625E Datasheet Download
XCZU2CG-1SFVA625E Overview
The XCZU2CG-1SFVA625E chip model is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the HDL (Hardware Description Language) language, which is a powerful tool used to create hardware designs. The chip model is well-suited to these applications due to its high speed and low power consumption.
The industry trends of the XCZU2CG-1SFVA625E chip model and the future development of related industries will depend on the specific technologies needed. It is possible that the application environment may require the support of new technologies in order to take advantage of the chip model's capabilities.
The original design intention of the XCZU2CG-1SFVA625E chip model was to provide a powerful and versatile solution for digital signal processing, embedded processing, and image processing. Its design was also intended to be easily upgradable, allowing for future improvements and capabilities. The chip model is also capable of being used in advanced communication systems, such as 5G networks, as well as other data-intensive applications.
Overall, the XCZU2CG-1SFVA625E chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the HDL language, and is easily upgradable for future improvements and capabilities. The chip model is also capable of being used in advanced communication systems, such as 5G networks, as well as other data-intensive applications. As the industry evolves and new technologies are developed, the XCZU2CG-1SFVA625E chip model will remain a viable solution for these applications.
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5,567 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $72.7837 | $72.7837 |
10+ | $72.0010 | $720.0104 |
100+ | $68.0879 | $6,808.7940 |
1000+ | $64.1748 | $32,087.4200 |
10000+ | $58.6965 | $58,696.5000 |
The price is for reference only, please refer to the actual quotation! |