AMD Xilinx
XCZU29DR-2FFVF1760I
XCZU29DR-2FFVF1760I ECAD Model
XCZU29DR-2FFVF1760I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-12-19 |
XCZU29DR-2FFVF1760I Datasheet Download
XCZU29DR-2FFVF1760I Overview
The XCZU29DR-2FFVF1760I chip model is a powerful and versatile device that has been designed with the intention of providing a reliable and cost-effective solution for a wide range of applications. It is a highly capable device that can be used for various tasks, including advanced communication systems.
The XCZU29DR-2FFVF1760I chip model is designed to be powerful and flexible, allowing for the possibility of future upgrades and improvements. It can be used in a variety of intelligent scenarios, such as in networks, and can be used in the era of fully intelligent systems. It is also designed to be highly reliable and cost-effective, making it a great choice for many businesses and organizations.
The XCZU29DR-2FFVF1760I chip model is designed with specific requirements in mind. It is designed to be highly reliable, ensuring that it can be used in a variety of environments and applications. It is also designed to be cost-effective, making it a great choice for businesses and organizations that are on a budget. Additionally, it is designed to be highly versatile, allowing it to be used in a variety of applications and scenarios.
The XCZU29DR-2FFVF1760I chip model can be used in a variety of scenarios and applications. It can be used for a variety of communication systems, as well as for intelligent scenarios such as in networks. Additionally, it can be used in the era of fully intelligent systems, making it a great choice for businesses and organizations that are looking to stay ahead of the curve.
When considering the XCZU29DR-2FFVF1760I chip model, it is important to consider actual case studies and precautions. It is important to ensure that the device is properly installed and configured to ensure that it is functioning properly. Additionally, it is important to ensure that the device is regularly maintained and updated in order to ensure that it is functioning optimally. Furthermore, it is important to ensure that the device is compatible with the environment in which it is being used, as well as with the applications that are being used with it.
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1,620 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||