AMD Xilinx
XCZU28DR-2FFVG1517I
XCZU28DR-2FFVG1517I ECAD Model
XCZU28DR-2FFVG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-12-19 |
XCZU28DR-2FFVG1517I Datasheet Download
XCZU28DR-2FFVG1517I Overview
The chip model XCZU28DR-2FFVG1517I is a high-performance, low-power programmable logic device designed to meet the needs of embedded and digital signal processing applications. It is a powerful device that can be used in a wide range of applications, such as high-performance digital signal processing, embedded processing, image processing, and more. This chip model is versatile and can be used in both single-processor and multi-processor systems.
The XCZU28DR-2FFVG1517I is well suited for applications in the era of fully intelligent systems. Its high-performance and low-power capabilities make it an ideal choice for networks and intelligent scenarios. Its versatile architecture allows for the development of a wide range of applications, from high-performance digital signal processing to embedded processing and image processing. It also provides a high-level of reliability and scalability, allowing it to be used in a variety of applications.
In terms of product design and specific requirements, the XCZU28DR-2FFVG1517I is designed to meet the needs of embedded and digital signal processing applications. It is designed using the HDL language, and its architecture is optimized for high-performance and low-power operation. It also supports a wide range of peripherals, such as Ethernet, USB, and other peripherals.
In terms of case studies and precautions, the XCZU28DR-2FFVG1517I has been used in a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It has been used in projects such as the development of a high-performance, low-power digital signal processor for a medical application. In addition, it has also been used to develop an embedded processor for a voice recognition system.
When using the XCZU28DR-2FFVG1517I, it is important to take into account the design requirements of the project and the specific requirements of the application. It is also important to ensure that the chip is properly configured and that the necessary hardware and software are in place. Additionally, it is important to ensure that the chip is properly tested and that any potential problems are identified and addressed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||