AMD Xilinx
XCZU19EG-L2FFVC1760E
XCZU19EG-L2FFVC1760E ECAD Model
XCZU19EG-L2FFVC1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU19EG-L2FFVC1760E Datasheet Download
XCZU19EG-L2FFVC1760E Overview
The XCZU19EG-L2FFVC1760E chip model is a powerful and versatile processor that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language that is used to program and control the chip.
The XCZU19EG-L2FFVC1760E chip model offers several advantages over other chips. It has a high processing speed, which allows it to process data quickly and efficiently. It also has a low power consumption, which makes it ideal for applications where energy efficiency is a priority. Additionally, the chip model is highly scalable, meaning that it can be used in a variety of applications and can be easily upgraded as technology advances.
The demand for the XCZU19EG-L2FFVC1760E chip model is expected to continue to grow in the future as more applications require the use of HDL language and high-performance digital signal processing. As technology continues to advance, the chip model will need to be updated to keep up with the latest developments in the industry. Additionally, the chip model will need to be compatible with any new technologies that may be required for the application environment.
Overall, the XCZU19EG-L2FFVC1760E chip model is a powerful processor that is suitable for a range of applications. Its high processing speed, low power consumption, and scalability make it an attractive choice for many industries. With the continued advancement of technology, the chip model will need to be updated to keep up with the latest developments, and the demand for the chip model is expected to continue to grow in the future.
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4,638 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,928.3700 | $3,928.3700 |
| 10+ | $3,886.1295 | $38,861.2950 |
| 100+ | $3,674.9268 | $367,492.6806 |
| 1000+ | $3,463.7241 | $1,731,862.0580 |
| 10000+ | $3,168.0404 | $3,168,040.3500 |
| The price is for reference only, please refer to the actual quotation! | ||