AMD Xilinx
XCZU19EG-L1FFVB1517I
XCZU19EG-L1FFVB1517I ECAD Model
XCZU19EG-L1FFVB1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU19EG-L1FFVB1517I Datasheet Download
XCZU19EG-L1FFVB1517I Overview
The XCZU19EG-L1FFVB1517I is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is an ideal choice for advanced communication systems, as it is capable of meeting the requirements of most applications.
The design of the XCZU19EG-L1FFVB1517I was intended to provide users with a powerful, versatile, and reliable chip model. This chip model is capable of meeting the requirements of most applications, and is designed to be flexible enough to accommodate future upgrades. It is designed to be compatible with HDL language, making it easy for users to program and use the chip.
The product description of the XCZU19EG-L1FFVB1517I includes features such as high-performance digital signal processing, embedded processing, image processing, and compatibility with HDL language. It also includes a variety of features designed to improve the performance of the chip, such as a high-speed data bus, a high-speed clock, and advanced power management.
In addition to the product description, there are also a number of case studies available that demonstrate how the XCZU19EG-L1FFVB1517I can be used in various applications. These case studies provide users with a better understanding of the chip's capabilities, as well as tips and advice on how to get the most out of the chip.
When using the XCZU19EG-L1FFVB1517I, it is important to take the necessary precautions to ensure that the chip is used correctly. This includes ensuring that the chip is properly powered and that the correct programming language is used. Additionally, it is important to ensure that the chip is not overclocked, as this can cause permanent damage to the chip.
In conclusion, the XCZU19EG-L1FFVB1517I is a powerful and versatile chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be flexible enough to accommodate future upgrades, and is compatible with HDL language. The product description, case studies, and precautions should be taken into account when using the XCZU19EG-L1FFVB1517I in order to get the most out of the chip.
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2,426 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,864.1790 | $2,864.1790 |
| 10+ | $2,833.3814 | $28,333.8141 |
| 100+ | $2,679.3933 | $267,939.3288 |
| 1000+ | $2,525.4052 | $1,262,702.5840 |
| 10000+ | $2,309.8218 | $2,309,821.8000 |
| The price is for reference only, please refer to the actual quotation! | ||