AMD Xilinx
XCZU19EG-2FFVD1760I
XCZU19EG-2FFVD1760I ECAD Model
XCZU19EG-2FFVD1760I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1760,42X42,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU19EG-2FFVD1760I Datasheet Download
XCZU19EG-2FFVD1760I Overview
The XCZU19EG-2FFVD1760I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. This model is designed to be used with the HDL language, which is a hardware description language used to program digital circuits. With this chip model, users can create complex digital circuits with ease, making it a great choice for high-performance applications.
The XCZU19EG-2FFVD1760I chip model offers many advantages, such as its high performance, low power consumption, and small size. It is also designed to be compatible with a wide range of other components, making it easier to integrate into existing systems. Additionally, the HDL language used to program the chip model is flexible and easy to use, making it a great choice for those who are new to digital circuit design.
The XCZU19EG-2FFVD1760I chip model is expected to be in high demand in related industries in the future. With its high performance and low power consumption, it is a great choice for applications that require complex digital circuits. Additionally, its compatibility with other components makes it a great choice for those looking to integrate existing systems with new technologies.
The application environment of the XCZU19EG-2FFVD1760I chip model may require the support of new technologies, depending on the specific requirements of the application. However, the chip model offers a great deal of flexibility and is designed to be compatible with a wide range of components, making it a great choice for those looking to integrate new technologies into existing systems.
Overall, the XCZU19EG-2FFVD1760I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and offers a great deal of flexibility and compatibility with existing systems. It is expected to be in high demand in related industries in the future and may require the support of new technologies, depending on the specific requirements of the application.
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5,202 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,353.6755 | $4,353.6755 |
| 10+ | $4,306.8618 | $43,068.6178 |
| 100+ | $4,072.7932 | $407,279.3205 |
| 1000+ | $3,838.7246 | $1,919,362.3150 |
| 10000+ | $3,511.0286 | $3,511,028.6250 |
| The price is for reference only, please refer to the actual quotation! | ||