
AMD Xilinx
XCZU19EG-2FFVD1760E
XCZU19EG-2FFVD1760E ECAD Model
XCZU19EG-2FFVD1760E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.71 mm | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCZU19EG-2FFVD1760E Datasheet Download
XCZU19EG-2FFVD1760E Overview
The chip model XCZU19EG-2FFVD1760E is a powerful integrated circuit designed for high-performance computing, storage and communication applications. It is the latest model from Xilinx, a leading provider of programmable logic devices and other embedded systems. The XCZU19EG-2FFVD1760E is a high-end chip that provides superior performance and scalability. It features an integrated ARM Cortex-A53 processor, a high-speed DDR4 memory controller, and a PCIe Gen3 x8 interface.
The XCZU19EG-2FFVD1760E is expected to be widely used in various industries, including automotive, aerospace, industrial automation, medical, and consumer electronics. The chip model is suitable for applications that require high-performance computing, storage, and communication capabilities. It is also suitable for applications that need to be integrated with other devices and systems.
The XCZU19EG-2FFVD1760E is expected to become increasingly popular in the future due to its superior performance and scalability. It is expected to be widely used in the development and popularization of future intelligent robots. To use the chip model effectively, technical talents such as software engineers, hardware designers, and system architects are needed.
In order to use the XCZU19EG-2FFVD1760E effectively, the application environment must also support new technologies. These technologies include artificial intelligence, machine learning, and deep learning. These technologies are necessary for the development of intelligent robots and other applications that require high-performance computing, storage, and communication capabilities.
Overall, the XCZU19EG-2FFVD1760E is expected to be a popular chip model in the future due to its superior performance and scalability. It is expected to be widely used in the development and popularization of future intelligent robots. In order to use the chip model effectively, application environments must support new technologies such as artificial intelligence, machine learning, and deep learning. Technical talents such as software engineers, hardware designers, and system architects are also needed in order to use the chip model effectively.
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5,747 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,809.8525 | $3,809.8525 |
10+ | $3,768.8864 | $37,688.8635 |
100+ | $3,564.0556 | $356,405.5572 |
1000+ | $3,359.2248 | $1,679,612.3960 |
10000+ | $3,072.4617 | $3,072,461.7000 |
The price is for reference only, please refer to the actual quotation! |