AMD Xilinx
XCZU19EG-2FFVC1760E
XCZU19EG-2FFVC1760E ECAD Model
XCZU19EG-2FFVC1760E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.71 mm | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1760,42X42,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU19EG-2FFVC1760E Datasheet Download
XCZU19EG-2FFVC1760E Overview
The XCZU19EG-2FFVC1760E chip model is an advanced and powerful processor designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL (Hardware Description Language) language, and is capable of meeting the complex requirements of today's modern computing systems.
The XCZU19EG-2FFVC1760E chip model was designed with the intention of providing a powerful and reliable processor for digital signal processing, embedded processing, and image processing applications. It is capable of handling complex tasks and providing a high level of performance. The chip model also has the capability for future upgrades and modifications, allowing for continued development and improvement.
The XCZU19EG-2FFVC1760E chip model is designed to meet specific design requirements and specifications. It is capable of providing a high level of performance and reliability, while also being easy to use and maintain. The chip model is also capable of being used in advanced communication systems, making it a great choice for businesses and organizations that require a reliable and powerful processor.
In order to ensure that the XCZU19EG-2FFVC1760E chip model is used correctly, there are a few precautions that must be taken. First, it is important to ensure that the HDL language is correctly used when programming the chip model, as incorrect usage could lead to errors or unexpected results. Additionally, it is important to ensure that the chip model is properly maintained, as this can help to ensure that it continues to perform optimally.
There are a number of case studies which demonstrate the effectiveness of the XCZU19EG-2FFVC1760E chip model in various applications. These case studies provide a great insight into the capabilities of the chip model, and can help to provide an understanding of the potential applications of the chip model. Additionally, these case studies can help to identify potential issues and areas of improvement, allowing for further development and optimization of the chip model.
You May Also Be Interested In
5,216 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,096.3033 | $5,096.3033 |
| 10+ | $5,041.5043 | $50,415.0432 |
| 100+ | $4,767.5095 | $476,750.9520 |
| 1000+ | $4,493.5147 | $2,246,757.3600 |
| 10000+ | $4,109.9220 | $4,109,922.0000 |
| The price is for reference only, please refer to the actual quotation! | ||