XCZU19EG-2FFVB1517I
XCZU19EG-2FFVB1517I
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rohs

AMD Xilinx

XCZU19EG-2FFVB1517I


XCZU19EG-2FFVB1517I
F20-XCZU19EG-2FFVB1517I
Active
CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XCZU19EG-2FFVB1517I ECAD Model


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XCZU19EG-2FFVB1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU19EG-2FFVB1517I Datasheet Download


XCZU19EG-2FFVB1517I Overview



The XCZU19EG-2FFVB1517I chip model is a high-performance, low-power integrated circuit designed for digital signal processing, embedded processing, image processing, and other related applications. It requires the use of HDL language for programming and is suitable for a variety of applications.


As the demand for high-performance integrated circuits continues to increase, the XCZU19EG-2FFVB1517I chip model is well-positioned to take advantage of this trend. The chip model offers a number of advantages, including low power consumption, high processing speed, and a small form factor. Additionally, the chip model is highly scalable, allowing for easy integration into existing systems and the development of new systems.


The XCZU19EG-2FFVB1517I chip model is expected to be in high demand in the near future. Its low power consumption and high processing speed make it an ideal choice for a variety of applications, including embedded systems, image processing, and digital signal processing. Additionally, its small form factor and scalability make it an ideal choice for applications that require the support of new technologies.


The XCZU19EG-2FFVB1517I chip model is well-suited to meet the demands of the industry and is expected to continue to be in high demand in the future. Its low power consumption, high processing speed, small form factor, and scalability make it an ideal choice for a variety of applications. Additionally, its support for new technologies makes it an attractive option for those looking for an integrated circuit that can handle the demands of the future.



3,070 In Stock


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Unit Price: $3,519.8241
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,273.4364 $3,273.4364
10+ $3,238.2382 $32,382.3817
100+ $3,062.2470 $306,224.6967
1000+ $2,886.2558 $1,443,127.8810
10000+ $2,639.8681 $2,639,868.0750
The price is for reference only, please refer to the actual quotation!

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