XCZU19EG-1FFVC1760E
XCZU19EG-1FFVC1760E
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rohs

AMD Xilinx

XCZU19EG-1FFVC1760E


XCZU19EG-1FFVC1760E
F20-XCZU19EG-1FFVC1760E
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU19EG-1FFVC1760E ECAD Model


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XCZU19EG-1FFVC1760E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU19EG-1FFVC1760E Datasheet Download


XCZU19EG-1FFVC1760E Overview



The chip model XCZU19EG-1FFVC1760E is a powerful, high-performance processor designed for high-end communication systems. It is the flagship model of the Xilinx Zynq UltraScale+ family and is equipped with a wide range of features, including a high-speed, multi-core processor, a large FPGA fabric, and a variety of memory and storage options. With its advanced features, the XCZU19EG-1FFVC1760E is capable of handling complex tasks in communication systems with ease.


The XCZU19EG-1FFVC1760E is designed to meet the requirements of modern communication systems, such as high-speed data transmission, low latency, and high reliability. It is capable of supporting a wide range of technologies, including Ethernet, Wi-Fi, Bluetooth, and other wireless protocols. The chip also has a range of features to ensure the security of data transmission, such as encryption and authentication.


When it comes to industry trends, the XCZU19EG-1FFVC1760E is well-positioned to take advantage of the latest developments in the communication industry. As the demand for faster and more reliable data transmission increases, the chip is capable of meeting these needs. It can also be upgraded to support new technologies as they become available, ensuring that it can remain competitive in the ever-evolving communication market.


When it comes to the product description and specific design requirements of the XCZU19EG-1FFVC1760E, the chip is designed to provide maximum performance and efficiency. It is capable of handling a wide range of tasks, from high-speed data transmission to low-power, low-latency operations. It also has a range of features that ensure the security of data transmission, such as encryption and authentication.


In terms of actual case studies and precautions, the XCZU19EG-1FFVC1760E has been used in a variety of applications, including military and aerospace, medical, automotive, and industrial. In each case, the chip has been able to provide the necessary performance and reliability, while also ensuring the security of data transmission. As such, it is a reliable and secure choice for any communication system.


In conclusion, the XCZU19EG-1FFVC1760E is an advanced, high-performance processor designed for high-end communication systems. It is capable of supporting a wide range of technologies and can be upgraded to support new technologies as they become available. It is also capable of handling a wide range of tasks, while ensuring the security of data transmission. With its advanced features, the XCZU19EG-1FFVC1760E is well-positioned to take advantage of the latest developments in the communication industry.



3,152 In Stock


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Unit Price: $2,639.7022
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,454.9230 $2,454.9230
10+ $2,428.5260 $24,285.2602
100+ $2,296.5409 $229,654.0914
1000+ $2,164.5558 $1,082,277.9020
10000+ $1,979.7767 $1,979,776.6500
The price is for reference only, please refer to the actual quotation!

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