AMD Xilinx
XCZU17EG-L2FFVC1760E
XCZU17EG-L2FFVC1760E ECAD Model
XCZU17EG-L2FFVC1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU17EG-L2FFVC1760E Datasheet Download
XCZU17EG-L2FFVC1760E Overview
The XCZU17EG-L2FFVC1760E chip model is a powerful and versatile chip that is designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of supporting high-level HDL language, giving it the potential for high-level communication systems. With its powerful processing capabilities, it is also suitable for the development and popularization of future intelligent robots.
The original design intention of the XCZU17EG-L2FFVC1760E was to create a powerful chip that could be used for a variety of applications. Its versatility makes it suitable for a wide range of tasks, from basic digital signal processing to complex image processing. It is also designed to be upgradeable, meaning that it can be used in the future for more advanced applications.
The XCZU17EG-L2FFVC1760E is a powerful and versatile chip that can be used to develop and popularize future intelligent robots. Its high-level HDL language support makes it suitable for advanced communication systems. To make full use of the chip, technical talents with knowledge of HDL language and experience in digital signal processing, embedded processing, and image processing are required.
Overall, the XCZU17EG-L2FFVC1760E is a powerful and versatile chip that can be used for a variety of applications. Its original design intention was to create a powerful chip that could be used for a variety of tasks, and it is designed to be upgradeable for future applications. It is also suitable for the development and popularization of future intelligent robots, and technical talents with knowledge of HDL language and experience in digital signal processing, embedded processing, and image processing are needed to use the chip effectively.
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2,650 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,566.6438 | $3,566.6438 |
| 10+ | $3,528.2928 | $35,282.9283 |
| 100+ | $3,336.5378 | $333,653.7783 |
| 1000+ | $3,144.7827 | $1,572,391.3690 |
| 10000+ | $2,876.3257 | $2,876,325.6750 |
| The price is for reference only, please refer to the actual quotation! | ||