XCZU17EG-L1FFVB1517I
XCZU17EG-L1FFVB1517I
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rohs

AMD Xilinx

XCZU17EG-L1FFVB1517I


XCZU17EG-L1FFVB1517I
F20-XCZU17EG-L1FFVB1517I
Active
CMOS, FCBGA-1517
FCBGA-1517

XCZU17EG-L1FFVB1517I ECAD Model


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XCZU17EG-L1FFVB1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-1517
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU17EG-L1FFVB1517I Datasheet Download


XCZU17EG-L1FFVB1517I Overview



The XCZU17EG-L1FFVB1517I chip model is an advanced integrated circuit that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for developers and engineers who are looking to create more powerful applications and platforms. The XCZU17EG-L1FFVB1517I chip model is capable of running a wide variety of HDL languages, including Verilog, VHDL, SystemVerilog, and SystemC, making it an ideal choice for developers who need to quickly and efficiently create powerful applications and platforms.


The XCZU17EG-L1FFVB1517I chip model has a number of advantages over other chip models. It is designed to be highly efficient, allowing developers to create applications and platforms that run faster and more efficiently than ever before. Additionally, the XCZU17EG-L1FFVB1517I chip model also allows developers to create applications and platforms that are more reliable and secure, making them ideal for applications that require a high level of security.


The XCZU17EG-L1FFVB1517I chip model is expected to be in high demand in the future, as more developers and engineers look to create more powerful applications and platforms. This chip model is ideal for applications that require a high level of performance and reliability, making it a great choice for developers who need to create applications and platforms that can handle a wide variety of tasks.


The XCZU17EG-L1FFVB1517I chip model can be used in the development and popularization of future intelligent robots. This chip model is capable of running a wide variety of HDL languages, making it an ideal choice for developers who need to quickly and efficiently create powerful applications and platforms for robotic applications. In order to use the XCZU17EG-L1FFVB1517I chip model effectively, developers will need to be knowledgeable in the HDL languages, as well as have a strong understanding of embedded systems and robotics.



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Unit Price: $2,796.3443
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,600.6002 $2,600.6002
10+ $2,572.6368 $25,726.3676
100+ $2,432.8195 $243,281.9541
1000+ $2,293.0023 $1,146,501.1630
10000+ $2,097.2582 $2,097,258.2250
The price is for reference only, please refer to the actual quotation!

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