
AMD Xilinx
XCZU17EG-L1FFVB1517I
XCZU17EG-L1FFVB1517I ECAD Model
XCZU17EG-L1FFVB1517I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-1517 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU17EG-L1FFVB1517I Datasheet Download
XCZU17EG-L1FFVB1517I Overview
The XCZU17EG-L1FFVB1517I chip model is an advanced integrated circuit that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for developers and engineers who are looking to create more powerful applications and platforms. The XCZU17EG-L1FFVB1517I chip model is capable of running a wide variety of HDL languages, including Verilog, VHDL, SystemVerilog, and SystemC, making it an ideal choice for developers who need to quickly and efficiently create powerful applications and platforms.
The XCZU17EG-L1FFVB1517I chip model has a number of advantages over other chip models. It is designed to be highly efficient, allowing developers to create applications and platforms that run faster and more efficiently than ever before. Additionally, the XCZU17EG-L1FFVB1517I chip model also allows developers to create applications and platforms that are more reliable and secure, making them ideal for applications that require a high level of security.
The XCZU17EG-L1FFVB1517I chip model is expected to be in high demand in the future, as more developers and engineers look to create more powerful applications and platforms. This chip model is ideal for applications that require a high level of performance and reliability, making it a great choice for developers who need to create applications and platforms that can handle a wide variety of tasks.
The XCZU17EG-L1FFVB1517I chip model can be used in the development and popularization of future intelligent robots. This chip model is capable of running a wide variety of HDL languages, making it an ideal choice for developers who need to quickly and efficiently create powerful applications and platforms for robotic applications. In order to use the XCZU17EG-L1FFVB1517I chip model effectively, developers will need to be knowledgeable in the HDL languages, as well as have a strong understanding of embedded systems and robotics.
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5,282 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,600.6002 | $2,600.6002 |
10+ | $2,572.6368 | $25,726.3676 |
100+ | $2,432.8195 | $243,281.9541 |
1000+ | $2,293.0023 | $1,146,501.1630 |
10000+ | $2,097.2582 | $2,097,258.2250 |
The price is for reference only, please refer to the actual quotation! |