
AMD Xilinx
XCZU17EG-2FFVC1760I
XCZU17EG-2FFVC1760I ECAD Model
XCZU17EG-2FFVC1760I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU17EG-2FFVC1760I Datasheet Download
XCZU17EG-2FFVC1760I Overview
The chip model XCZU17EG-2FFVC1760I is a new generation of field-programmable gate array (FPGA) from Xilinx, a leading semiconductor manufacturer. It is designed to meet the needs of the high-performance computing, embedded, and industrial markets. It is the first FPGA to offer the highest levels of performance, flexibility, and scalability.
The XCZU17EG-2FFVC1760I chip model is equipped with a large number of advanced features, including a high-performance processor, high-speed memory, and a wide range of I/O options. It also provides an integrated development environment, which enables users to quickly develop and deploy solutions. This chip model is ideal for applications such as artificial intelligence, machine learning, and cloud computing.
The XCZU17EG-2FFVC1760I chip model is highly versatile, making it suitable for a wide range of applications. It can be used for industrial automation and robotics, as well as for the development of intelligent robots. It is also suitable for use in medical, automotive, aerospace, and other industries.
In terms of industry trends, the XCZU17EG-2FFVC1760I chip model is expected to drive the development of new technologies in the future. It is likely to be used in the development of new applications and products, as well as to enable the use of new technologies in existing applications. This will require the support of new technologies, including artificial intelligence, machine learning, and cloud computing.
In terms of technical talents, the XCZU17EG-2FFVC1760I chip model requires users to have a good understanding of the FPGA architecture, as well as the programming languages and tools used to develop applications. Additionally, users must be familiar with the development environment and the various components that make up the FPGA. It is also important for users to have a good understanding of the chip model's features and capabilities, as well as its limitations.
The XCZU17EG-2FFVC1760I chip model is a powerful and versatile FPGA that is suitable for a wide range of applications. It is expected to drive the development of new technologies in the future and enable the use of new technologies in existing applications. In order to use the chip model effectively, users must have a good understanding of the FPGA architecture, as well as the programming languages and tools used to develop applications.
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5,751 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,287.5634 | $5,287.5634 |
10+ | $5,230.7078 | $52,307.0784 |
100+ | $4,946.4302 | $494,643.0240 |
1000+ | $4,662.1526 | $2,331,076.3200 |
10000+ | $4,264.1640 | $4,264,164.0000 |
The price is for reference only, please refer to the actual quotation! |