AMD Xilinx
XCZU17EG-2FFVC1760E
XCZU17EG-2FFVC1760E ECAD Model
XCZU17EG-2FFVC1760E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.71 mm | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1760,42X42,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU17EG-2FFVC1760E Datasheet Download
XCZU17EG-2FFVC1760E Overview
The XCZU17EG-2FFVC1760E chip model is a powerful, high-performance programmable logic device designed to meet the needs of a wide range of applications. It offers a wide range of features and capabilities, including high speed, low power consumption, and a wide range of I/O options. The chip model is designed to be used in a variety of applications, including embedded systems, industrial automation, and robotics.
The XCZU17EG-2FFVC1760E chip model is part of a new wave of technology that is revolutionizing the way we think about embedded systems and robotics. It offers a wide range of features and capabilities that make it ideal for use in a variety of applications, including embedded systems, industrial automation, and robotics. With its high speed and low power consumption, the chip model is well suited for use in a variety of applications.
The industry trends of the XCZU17EG-2FFVC1760E chip model are indicative of the future development of related industries. As the chip model is designed to be used in a variety of applications, it is likely that new technologies will be required to support the application environment. This could include new programming languages and development tools, as well as new hardware and software components.
The XCZU17EG-2FFVC1760E chip model can be used to great effect in the development and popularization of future intelligent robots. With its high speed and low power consumption, the chip model is well suited for use in a variety of robotic applications. Technical talents such as engineers, computer scientists, and software developers are needed to effectively use the chip model in the development of intelligent robots.
In conclusion, the XCZU17EG-2FFVC1760E chip model is a powerful, high-performance programmable logic device designed to meet the needs of a wide range of applications. It is part of a new wave of technology that is revolutionizing the way we think about embedded systems and robotics. The industry trends of the chip model are indicative of the future development of related industries, and new technologies may be required to support the application environment. Finally, the chip model can be used to great effect in the development and popularization of future intelligent robots, and technical talents are needed to effectively use the chip model in the development of intelligent robots.
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3,233 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,120.9682 | $3,120.9682 |
| 10+ | $3,087.4094 | $30,874.0942 |
| 100+ | $2,919.6154 | $291,961.5426 |
| 1000+ | $2,751.8214 | $1,375,910.7180 |
| 10000+ | $2,516.9099 | $2,516,909.8500 |
| The price is for reference only, please refer to the actual quotation! | ||