AMD Xilinx
XCZU17EG-1FFVD1760I
XCZU17EG-1FFVD1760I ECAD Model
XCZU17EG-1FFVD1760I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1760,42X42,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU17EG-1FFVD1760I Datasheet Download
XCZU17EG-1FFVD1760I Overview
The XCZU17EG-1FFVD1760I chip model is a powerful and versatile processor that is suitable for a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing, and it requires the use of HDL language. It is designed with scalability and flexibility in mind, allowing for future upgrades and modifications.
The XCZU17EG-1FFVD1760I chip model is designed to provide high performance and low power consumption, making it suitable for advanced communication systems. It features a dual-core ARM Cortex-A53 processor, a Mali-400 MP2 graphics processor, and a H.264/H.265 video encoder. It also supports DDR4 RAM, eMMC, and PCIe interfaces.
The product description and specific design requirements of the XCZU17EG-1FFVD1760I chip model are detailed in the product documentation. It is important to follow the instructions in the documentation to ensure that the chip is properly installed and configured. Additionally, some case studies and examples of the chip model in use can be found online.
When designing with the XCZU17EG-1FFVD1760I chip model, there are a few precautions to keep in mind. For example, the chip should not be exposed to high temperatures or humidity, and the power supply should not be overloaded. Additionally, proper grounding techniques should be used to ensure that the chip is properly protected from electrical interference.
Overall, the XCZU17EG-1FFVD1760I chip model is a powerful and versatile processor that is suitable for a variety of applications. It is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing, and it requires the use of HDL language. With its scalability and flexibility, it can be applied to advanced communication systems, and it is important to follow the instructions in the product documentation and take the necessary precautions when designing with this chip model.
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3,051 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,088.2520 | $3,088.2520 |
| 10+ | $3,055.0450 | $30,550.4501 |
| 100+ | $2,889.0100 | $288,900.9957 |
| 1000+ | $2,722.9749 | $1,361,487.4510 |
| 10000+ | $2,490.5258 | $2,490,525.8250 |
| The price is for reference only, please refer to the actual quotation! | ||