XCZU17EG-1FFVC1760E
XCZU17EG-1FFVC1760E
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rohs

AMD Xilinx

XCZU17EG-1FFVC1760E


XCZU17EG-1FFVC1760E
F20-XCZU17EG-1FFVC1760E
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU17EG-1FFVC1760E ECAD Model


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XCZU17EG-1FFVC1760E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU17EG-1FFVC1760E Datasheet Download


XCZU17EG-1FFVC1760E Overview



The XCZU17EG-1FFVC1760E chip model, released by Xilinx, is a high-end, high-performance FPGA chip model, with a wide range of applications in various fields. It is designed to be a cost-effective, high-performance FPGA solution for advanced communication systems.


The XCZU17EG-1FFVC1760E chip model is designed to meet the requirements of high-end communication systems. It is equipped with a high-speed transceiver and advanced I/O features, which can provide up to 17.6 Gbps data transmission rate. It also has advanced features such as high-speed memory controllers, high-speed clock management, and multiple clock domains. In addition, the chip model also supports the latest version of the Xilinx Vivado Design Suite, which provides users with a complete design environment.


The XCZU17EG-1FFVC1760E chip model can be used for the development and popularization of intelligent robots. The chip model has a powerful FPGA core and high-speed transceiver, which can be used to process and store data in real-time. In addition, the chip model also supports the latest version of the Xilinx Vivado Design Suite, which provides users with a complete design environment and a wide range of software tools for developing and debugging intelligent robotic applications.


In order to use the XCZU17EG-1FFVC1760E chip model effectively, technical talents such as engineers, software developers, and roboticists are needed. Engineers must have a comprehensive understanding of the chip model, including its features, design requirements, and actual case studies. Software developers must have a deep understanding of the Xilinx Vivado Design Suite, and be able to use the suite to develop and debug applications. Finally, roboticists must have a deep understanding of robotics and be able to use the chip model to develop and deploy intelligent robots.


The XCZU17EG-1FFVC1760E chip model is an excellent choice for advanced communication systems, as well as for the development and popularization of intelligent robots. With its powerful FPGA core, high-speed transceiver, and support for the Xilinx Vivado Design Suite, the chip model is sure to provide users with an effective and cost-efficient solution. In order to use the chip model effectively, however, technical talents such as engineers, software developers, and roboticists are needed.



1,315 In Stock


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Unit Price: $3,553.224
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,304.4983 $3,304.4983
10+ $3,268.9661 $32,689.6608
100+ $3,091.3049 $309,130.4880
1000+ $2,913.6437 $1,456,821.8400
10000+ $2,664.9180 $2,664,918.0000
The price is for reference only, please refer to the actual quotation!

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