
AMD Xilinx
XCZU17EG-1FFVC1760E
XCZU17EG-1FFVC1760E ECAD Model
XCZU17EG-1FFVC1760E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU17EG-1FFVC1760E Datasheet Download
XCZU17EG-1FFVC1760E Overview
The XCZU17EG-1FFVC1760E chip model, released by Xilinx, is a high-end, high-performance FPGA chip model, with a wide range of applications in various fields. It is designed to be a cost-effective, high-performance FPGA solution for advanced communication systems.
The XCZU17EG-1FFVC1760E chip model is designed to meet the requirements of high-end communication systems. It is equipped with a high-speed transceiver and advanced I/O features, which can provide up to 17.6 Gbps data transmission rate. It also has advanced features such as high-speed memory controllers, high-speed clock management, and multiple clock domains. In addition, the chip model also supports the latest version of the Xilinx Vivado Design Suite, which provides users with a complete design environment.
The XCZU17EG-1FFVC1760E chip model can be used for the development and popularization of intelligent robots. The chip model has a powerful FPGA core and high-speed transceiver, which can be used to process and store data in real-time. In addition, the chip model also supports the latest version of the Xilinx Vivado Design Suite, which provides users with a complete design environment and a wide range of software tools for developing and debugging intelligent robotic applications.
In order to use the XCZU17EG-1FFVC1760E chip model effectively, technical talents such as engineers, software developers, and roboticists are needed. Engineers must have a comprehensive understanding of the chip model, including its features, design requirements, and actual case studies. Software developers must have a deep understanding of the Xilinx Vivado Design Suite, and be able to use the suite to develop and debug applications. Finally, roboticists must have a deep understanding of robotics and be able to use the chip model to develop and deploy intelligent robots.
The XCZU17EG-1FFVC1760E chip model is an excellent choice for advanced communication systems, as well as for the development and popularization of intelligent robots. With its powerful FPGA core, high-speed transceiver, and support for the Xilinx Vivado Design Suite, the chip model is sure to provide users with an effective and cost-efficient solution. In order to use the chip model effectively, however, technical talents such as engineers, software developers, and roboticists are needed.
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1,315 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,304.4983 | $3,304.4983 |
10+ | $3,268.9661 | $32,689.6608 |
100+ | $3,091.3049 | $309,130.4880 |
1000+ | $2,913.6437 | $1,456,821.8400 |
10000+ | $2,664.9180 | $2,664,918.0000 |
The price is for reference only, please refer to the actual quotation! |