XCZU17EG-1FFVB1517I
XCZU17EG-1FFVB1517I
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rohs

AMD Xilinx

XCZU17EG-1FFVB1517I


XCZU17EG-1FFVB1517I
F20-XCZU17EG-1FFVB1517I
Active
CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XCZU17EG-1FFVB1517I ECAD Model


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XCZU17EG-1FFVB1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU17EG-1FFVB1517I Datasheet Download


XCZU17EG-1FFVB1517I Overview



The XCZU17EG-1FFVB1517I chip model is a high performance programmable logic device that is capable of delivering exceptional results. It is a powerful and reliable solution for a variety of applications, including network and intelligent scenarios. This chip model offers a wide range of features that make it an ideal choice for those seeking to take advantage of the latest technologies.


The XCZU17EG-1FFVB1517I chip model has many advantages, including a high-speed serial transceiver, a wide range of logic resources, and a wide range of I/O options. It also offers a low power consumption, a low cost, and a high level of integration. These features make it an ideal choice for those looking to develop and deploy new and innovative applications.


The demand for the XCZU17EG-1FFVB1517I chip model is expected to grow in the future as the need for more powerful and reliable solutions increases. This chip model is expected to be used in a variety of applications, including networks, intelligent scenarios, and the development and popularization of future intelligent robots. It is also expected to be used in the era of fully intelligent systems, as it can provide the necessary performance and reliability needed to make these systems a reality.


The chip model XCZU17EG-1FFVB1517I can be applied to the development and popularization of future intelligent robots. It is capable of delivering high performance and reliability, as well as providing a low cost and low power consumption. In order to effectively use this chip model, it is important to have the necessary technical skills and expertise. This includes knowledge of programming languages, microprocessors, and embedded systems. Additionally, it is important to have a good understanding of the different types of sensors and actuators used in robotic systems.


The XCZU17EG-1FFVB1517I chip model is a powerful and reliable solution for a variety of applications, including networks and intelligent scenarios. It offers a wide range of features that make it an ideal choice for those seeking to take advantage of the latest technologies. The expected demand for this chip model is expected to grow in the future, as the need for more powerful and reliable solutions increases. Additionally, it can be applied to the development and popularization of future intelligent robots, and it is important to have the necessary technical skills and expertise in order to effectively use this chip model.



1,359 In Stock


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Unit Price: $2,496.9976
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,322.2078 $2,322.2078
10+ $2,297.2378 $22,972.3779
100+ $2,172.3879 $217,238.7912
1000+ $2,047.5380 $1,023,769.0160
10000+ $1,872.7482 $1,872,748.2000
The price is for reference only, please refer to the actual quotation!

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