AMD Xilinx
XCZU17EG-1FFVB1517E
XCZU17EG-1FFVB1517E ECAD Model
XCZU17EG-1FFVB1517E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU17EG-1FFVB1517E Datasheet Download
XCZU17EG-1FFVB1517E Overview
The XCZU17EG-1FFVB1517E chip model is a powerful and innovative solution for a variety of applications. It is a high-performance digital signal processor, embedded processor, and image processor, making it suitable for a range of applications. The model requires the use of the HDL language for programming, making it a great choice for those who need to develop complex applications.
The XCZU17EG-1FFVB1517E chip model has a number of advantages over other models. It is designed to provide high-performance processing power and low power consumption. It also has a small form factor and is highly configurable, making it ideal for a variety of applications. Additionally, the model is designed to be compatible with a range of other technologies, making it a great choice for those looking to create a custom solution.
The chip model XCZU17EG-1FFVB1517E is expected to be in high demand in the coming years. As the demand for high-performance digital signal processors and embedded processors continues to grow, the demand for the XCZU17EG-1FFVB1517E chip model is expected to remain strong. Additionally, the model is expected to be used in a variety of applications, from medical imaging to robotics.
In terms of future development, the XCZU17EG-1FFVB1517E chip model may require the support of new technologies. As the model is designed to be highly configurable and compatible with a range of other technologies, it is likely that new technologies will be required to make the most of the model's capabilities. Additionally, the model is likely to be used in a variety of applications, requiring the support of a range of technologies.
Overall, the XCZU17EG-1FFVB1517E chip model is an innovative and powerful solution for a variety of applications. With its high-performance processing power, low power consumption, and small form factor, the model is expected to be in high demand in the coming years. Additionally, the model may require the support of new technologies to make the most of its capabilities. As such, the XCZU17EG-1FFVB1517E chip model is likely to remain a popular choice for those looking to create custom solutions.
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4,223 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,753.5961 | $2,753.5961 |
| 10+ | $2,723.9875 | $27,239.8752 |
| 100+ | $2,575.9447 | $257,594.4720 |
| 1000+ | $2,427.9019 | $1,213,950.9600 |
| 10000+ | $2,220.6420 | $2,220,642.0000 |
| The price is for reference only, please refer to the actual quotation! | ||