AMD Xilinx
XCZU15EG-3FFVC900E
XCZU15EG-3FFVC900E ECAD Model
XCZU15EG-3FFVC900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU15EG-3FFVC900E Datasheet Download
XCZU15EG-3FFVC900E Overview
The Xilinx XCZU15EG-3FFVC900E chip model is a high-end FPGA designed for embedded applications such as aerospace, automotive, and industrial automation. It is a powerful, flexible, and cost-effective solution for many types of applications.
The XCZU15EG-3FFVC900E is built on the Zynq UltraScale+ MPSoC architecture and is equipped with a 1.5GHz quad-core ARM Cortex-A53, a 600MHz dual-core ARM Cortex-R5, and a Mali-400MP2 GPU. It also features a hardened H.264/H.265 video codec, a DDR4 controller, and a high-speed transceiver. This makes it an ideal solution for applications that require high-performance processing and connectivity.
The XCZU15EG-3FFVC900E is designed with the latest technologies and features, such as low-power operation, high-speed transceivers, and advanced security features. This makes it a great choice for applications that require high-performance processing and connectivity. Additionally, the FPGA is designed to be upgradable, allowing users to easily upgrade their systems to the latest technologies.
The XCZU15EG-3FFVC900E is expected to have a strong future demand in the related industries, as its features and capabilities make it a great choice for applications that require high-performance processing and connectivity. It is also designed to be upgradable, allowing users to easily upgrade their systems to the latest technologies.
In terms of its application environment, the XCZU15EG-3FFVC900E is capable of supporting advanced communication systems with its high-speed transceivers and hardened H.264/H.265 video codec. This makes it a great choice for applications that require high-performance processing and connectivity. Additionally, the FPGA is designed to be upgradable, allowing users to easily upgrade their systems to the latest technologies.
In conclusion, the Xilinx XCZU15EG-3FFVC900E chip model is a powerful, flexible, and cost-effective solution for many types of applications. It is designed with the latest technologies and features, such as low-power operation, high-speed transceivers, and advanced security features. Furthermore, it is capable of supporting advanced communication systems with its high-speed transceivers and hardened H.264/H.265 video codec. With its upgradability and strong future demand in related industries, the XCZU15EG-3FFVC900E is a great choice for applications that require high-performance processing and connectivity.
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1,575 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,165.4119 | $3,165.4119 |
| 10+ | $3,131.3752 | $31,313.7520 |
| 100+ | $2,961.1918 | $296,119.1769 |
| 1000+ | $2,791.0083 | $1,395,504.1670 |
| 10000+ | $2,552.7515 | $2,552,751.5250 |
| The price is for reference only, please refer to the actual quotation! | ||