XCZU15EG-3FFVB1156E
XCZU15EG-3FFVB1156E
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AMD Xilinx

XCZU15EG-3FFVB1156E


XCZU15EG-3FFVB1156E
F20-XCZU15EG-3FFVB1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU15EG-3FFVB1156E ECAD Model


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XCZU15EG-3FFVB1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU15EG-3FFVB1156E Datasheet Download


XCZU15EG-3FFVB1156E Overview



The Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is a powerful, high-performance, and low-power chip model that is designed to meet the needs of a wide range of applications. It is a System on Chip (SoC) that combines the features of a programmable logic device with the features of a microprocessor, allowing for greater flexibility and more efficient use of resources.


The Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is ideal for applications that require high-performance, low-power processing, such as embedded systems, industrial automation, and automotive. It supports a wide range of communication protocols, including Ethernet, USB, CAN, and serial. It also supports a variety of analog and digital peripherals, allowing for a more comprehensive solution.


The chip model XCZU15EG-3FFVB1156E offers a number of advantages, including low power consumption, high performance, and scalability. It is also capable of supporting advanced communication systems, such as 5G, Wi-Fi 6, and Bluetooth 5.0. The chip model is also designed to be easily upgradable, allowing for future upgrades and enhancements.


The Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is expected to be in high demand in the future, as the need for low-power, high-performance processing increases. It is also expected to be used in a variety of applications, from consumer electronics to industrial automation. As more applications require the support of new technologies, such as 5G and Wi-Fi 6, the chip model will be able to meet the needs of these applications.


In conclusion, the Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is a powerful, low-power, and high-performance chip model that is designed to meet the needs of a wide range of applications. It is capable of supporting advanced communication systems, such as 5G and Wi-Fi 6, and is designed to be easily upgradable. The chip model is expected to be in high demand in the future, as the need for low-power, high-performance processing increases.



3,099 In Stock


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Unit Price: $3,845.72
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,576.5196 $3,576.5196
10+ $3,538.0624 $35,380.6240
100+ $3,345.7764 $334,577.6400
1000+ $3,153.4904 $1,576,745.2000
10000+ $2,884.2900 $2,884,290.0000
The price is for reference only, please refer to the actual quotation!

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