
AMD Xilinx
XCZU15EG-3FFVB1156E
XCZU15EG-3FFVB1156E ECAD Model
XCZU15EG-3FFVB1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU15EG-3FFVB1156E Datasheet Download
XCZU15EG-3FFVB1156E Overview
The Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is a powerful, high-performance, and low-power chip model that is designed to meet the needs of a wide range of applications. It is a System on Chip (SoC) that combines the features of a programmable logic device with the features of a microprocessor, allowing for greater flexibility and more efficient use of resources.
The Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is ideal for applications that require high-performance, low-power processing, such as embedded systems, industrial automation, and automotive. It supports a wide range of communication protocols, including Ethernet, USB, CAN, and serial. It also supports a variety of analog and digital peripherals, allowing for a more comprehensive solution.
The chip model XCZU15EG-3FFVB1156E offers a number of advantages, including low power consumption, high performance, and scalability. It is also capable of supporting advanced communication systems, such as 5G, Wi-Fi 6, and Bluetooth 5.0. The chip model is also designed to be easily upgradable, allowing for future upgrades and enhancements.
The Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is expected to be in high demand in the future, as the need for low-power, high-performance processing increases. It is also expected to be used in a variety of applications, from consumer electronics to industrial automation. As more applications require the support of new technologies, such as 5G and Wi-Fi 6, the chip model will be able to meet the needs of these applications.
In conclusion, the Xilinx Zynq UltraScale+ XCZU15EG-3FFVB1156E is a powerful, low-power, and high-performance chip model that is designed to meet the needs of a wide range of applications. It is capable of supporting advanced communication systems, such as 5G and Wi-Fi 6, and is designed to be easily upgradable. The chip model is expected to be in high demand in the future, as the need for low-power, high-performance processing increases.
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3,099 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,576.5196 | $3,576.5196 |
10+ | $3,538.0624 | $35,380.6240 |
100+ | $3,345.7764 | $334,577.6400 |
1000+ | $3,153.4904 | $1,576,745.2000 |
10000+ | $2,884.2900 | $2,884,290.0000 |
The price is for reference only, please refer to the actual quotation! |