AMD Xilinx
XCZU15EG-2FFVC900I
XCZU15EG-2FFVC900I ECAD Model
XCZU15EG-2FFVC900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU15EG-2FFVC900I Datasheet Download
XCZU15EG-2FFVC900I Overview
The chip model XCZU15EG-2FFVC900I has recently become one of the most popular models in the chip industry. It is an important component of the modern communication system and has been widely used in various fields. This model is designed to provide high-performance computing and networking capabilities. It has a wide range of applications, from consumer electronics to industrial automation.
The chip model XCZU15EG-2FFVC900I is based on the Xilinx UltraScale+ FPGA architecture, which combines the latest technologies in FPGA design to offer a high-performance, low-power solution. The model has a high-speed transceiver and advanced memory interface, which makes it suitable for a variety of applications. It also has a wide range of I/O options, which makes it suitable for a variety of applications.
The chip model XCZU15EG-2FFVC900I is designed to be able to support the development of advanced communication systems. It has a wide range of communication protocols, such as Ethernet, USB, and PCIe, which makes it suitable for a variety of applications. It also has a wide range of security features, such as encryption and authentication, which make it suitable for secure communication.
The chip model XCZU15EG-2FFVC900I is also capable of supporting the development and popularization of future intelligent robots. It has a wide range of integrated sensors, such as image sensors and motion sensors, which makes it suitable for a variety of robotic applications. It also has a wide range of programming options, such as C/C++ and Python, which make it suitable for a variety of applications.
In terms of the future development of the chip model XCZU15EG-2FFVC900I, it is possible to upgrade the model to support new technologies. However, it depends on what specific technologies are needed. In addition, the application environment may require the support of new technologies. To use the model effectively, technical talents are needed in the areas of FPGA design, embedded systems, communication protocols, and software development.
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3,038 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,596.8968 | $2,596.8968 |
| 10+ | $2,568.9731 | $25,689.7313 |
| 100+ | $2,429.3550 | $242,935.5027 |
| 1000+ | $2,289.7369 | $1,144,868.4610 |
| 10000+ | $2,094.2716 | $2,094,271.5750 |
| The price is for reference only, please refer to the actual quotation! | ||