
AMD Xilinx
XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I ECAD Model
XCZU15EG-2FFVB1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU15EG-2FFVB1156I Datasheet Download
XCZU15EG-2FFVB1156I Overview
The chip model XCZU15EG-2FFVB1156I is a newly released model from Xilinx, a leading provider of programmable logic devices. This model is the latest addition to the Zynq UltraScale+ family, and it is designed to meet the needs of a wide range of applications. It features a high-performance, low-power, and highly-scalable architecture that is ideal for a variety of applications.
The XCZU15EG-2FFVB1156I has a number of advantages that make it an attractive choice for a variety of applications. It is capable of supporting multiple processors, including ARM Cortex-A53 and ARM Cortex-R5 cores. It also features a wide range of peripherals, including Gigabit Ethernet, USB 3.0, SATA, and PCIe. Furthermore, it supports a variety of memory configurations, including DDR4, LPDDR4, and QDR-IV SRAM.
In terms of industry trends, the XCZU15EG-2FFVB1156I is expected to be in high demand in the future. This is due to its high performance, low power consumption, and scalability, which make it well-suited for a wide range of applications. Furthermore, the chip model is designed to be highly compatible with existing technologies, making it an attractive choice for developers looking to upgrade their systems.
The original design intention of the XCZU15EG-2FFVB1156I was to provide a powerful and flexible platform for a variety of applications. As such, the chip can be used in advanced communication systems, such as 5G and 6G networks. Furthermore, the chip can be used in a variety of other applications, such as artificial intelligence, machine learning, and autonomous driving.
In terms of future upgrades, the XCZU15EG-2FFVB1156I is designed to be highly flexible and able to adapt to changing application requirements. This means that the chip can be upgraded to support new technologies, such as new processor cores, memory configurations, and peripherals. Furthermore, the chip can be used in a variety of new applications, such as edge computing and the Internet of Things.
Overall, the XCZU15EG-2FFVB1156I is a powerful and flexible chip model that is well-suited for a wide range of applications. It is designed to be highly compatible with existing technologies, making it an attractive choice for developers looking to upgrade their systems. Furthermore, the chip can be upgraded to support new technologies, making it suitable for a variety of new applications.
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2,767 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,934.5493 | $2,934.5493 |
10+ | $2,902.9950 | $29,029.9505 |
100+ | $2,745.2236 | $274,522.3578 |
1000+ | $2,587.4521 | $1,293,726.0540 |
10000+ | $2,366.5721 | $2,366,572.0500 |
The price is for reference only, please refer to the actual quotation! |