XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I
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rohs

AMD Xilinx

XCZU15EG-2FFVB1156I


XCZU15EG-2FFVB1156I
F20-XCZU15EG-2FFVB1156I
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU15EG-2FFVB1156I ECAD Model


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XCZU15EG-2FFVB1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU15EG-2FFVB1156I Datasheet Download


XCZU15EG-2FFVB1156I Overview



The chip model XCZU15EG-2FFVB1156I is a newly released model from Xilinx, a leading provider of programmable logic devices. This model is the latest addition to the Zynq UltraScale+ family, and it is designed to meet the needs of a wide range of applications. It features a high-performance, low-power, and highly-scalable architecture that is ideal for a variety of applications.


The XCZU15EG-2FFVB1156I has a number of advantages that make it an attractive choice for a variety of applications. It is capable of supporting multiple processors, including ARM Cortex-A53 and ARM Cortex-R5 cores. It also features a wide range of peripherals, including Gigabit Ethernet, USB 3.0, SATA, and PCIe. Furthermore, it supports a variety of memory configurations, including DDR4, LPDDR4, and QDR-IV SRAM.


In terms of industry trends, the XCZU15EG-2FFVB1156I is expected to be in high demand in the future. This is due to its high performance, low power consumption, and scalability, which make it well-suited for a wide range of applications. Furthermore, the chip model is designed to be highly compatible with existing technologies, making it an attractive choice for developers looking to upgrade their systems.


The original design intention of the XCZU15EG-2FFVB1156I was to provide a powerful and flexible platform for a variety of applications. As such, the chip can be used in advanced communication systems, such as 5G and 6G networks. Furthermore, the chip can be used in a variety of other applications, such as artificial intelligence, machine learning, and autonomous driving.


In terms of future upgrades, the XCZU15EG-2FFVB1156I is designed to be highly flexible and able to adapt to changing application requirements. This means that the chip can be upgraded to support new technologies, such as new processor cores, memory configurations, and peripherals. Furthermore, the chip can be used in a variety of new applications, such as edge computing and the Internet of Things.


Overall, the XCZU15EG-2FFVB1156I is a powerful and flexible chip model that is well-suited for a wide range of applications. It is designed to be highly compatible with existing technologies, making it an attractive choice for developers looking to upgrade their systems. Furthermore, the chip can be upgraded to support new technologies, making it suitable for a variety of new applications.



2,767 In Stock


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Unit Price: $3,155.4294
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,934.5493 $2,934.5493
10+ $2,902.9950 $29,029.9505
100+ $2,745.2236 $274,522.3578
1000+ $2,587.4521 $1,293,726.0540
10000+ $2,366.5721 $2,366,572.0500
The price is for reference only, please refer to the actual quotation!

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