
AMD Xilinx
XCZU15EG-1FFVC900E
XCZU15EG-1FFVC900E ECAD Model
XCZU15EG-1FFVC900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU15EG-1FFVC900E Datasheet Download
XCZU15EG-1FFVC900E Overview
The chip model XCZU15EG-1FFVC900E is a powerful and versatile chip model that has recently been released by Xilinx, Inc. It is a high-performance FPGA with a 900K logic cell count and a wide range of features and capabilities. The model is designed to meet the needs of a variety of applications, including high-end computing, networking, and storage.
The XCZU15EG-1FFVC900E chip model has several advantages that make it an attractive choice for many applications. It has a high logic cell count, which allows it to process large amounts of data quickly and efficiently. Additionally, it has a low power consumption, making it ideal for applications that require long-term operation. Its wide range of features also enables it to be used in a variety of applications, including artificial intelligence, machine learning, and robotics.
Given the features and capabilities of the XCZU15EG-1FFVC900E chip model, it is expected that the demand for this model will continue to grow in the future. This is due to the increasing need for high-performance computing, networking, and storage solutions. Additionally, the chip model is expected to be used in a variety of new applications, such as artificial intelligence, machine learning, and robotics.
In order to use the XCZU15EG-1FFVC900E chip model effectively, it is important to understand the product description and specific design requirements. The product description includes the logic cell count, the power consumption, the range of features, and the supported applications. Additionally, it is important to understand the actual case studies and precautions associated with the chip model. This includes understanding the potential risks associated with the chip model and how to mitigate them.
The XCZU15EG-1FFVC900E chip model is well-suited for the development and popularization of future intelligent robots. This is due to its high logic cell count, low power consumption, and wide range of features and capabilities. Additionally, the chip model is expected to be used in a variety of new applications, such as artificial intelligence, machine learning, and robotics. In order to use the chip model effectively, it is important to have a deep understanding of the product description and design requirements. Additionally, it is important to have the technical skills necessary to work with the chip model, including understanding the potential risks associated with the chip model and how to mitigate them.
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4,699 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,623.4463 | $1,623.4463 |
10+ | $1,605.9899 | $16,059.8990 |
100+ | $1,518.7078 | $151,870.7844 |
1000+ | $1,431.4258 | $715,712.8920 |
10000+ | $1,309.2309 | $1,309,230.9000 |
The price is for reference only, please refer to the actual quotation! |