XCZU15EG-1FFVC900E
XCZU15EG-1FFVC900E
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rohs

AMD Xilinx

XCZU15EG-1FFVC900E


XCZU15EG-1FFVC900E
F20-XCZU15EG-1FFVC900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU15EG-1FFVC900E ECAD Model


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XCZU15EG-1FFVC900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU15EG-1FFVC900E Datasheet Download


XCZU15EG-1FFVC900E Overview



The chip model XCZU15EG-1FFVC900E is a powerful and versatile chip model that has recently been released by Xilinx, Inc. It is a high-performance FPGA with a 900K logic cell count and a wide range of features and capabilities. The model is designed to meet the needs of a variety of applications, including high-end computing, networking, and storage.


The XCZU15EG-1FFVC900E chip model has several advantages that make it an attractive choice for many applications. It has a high logic cell count, which allows it to process large amounts of data quickly and efficiently. Additionally, it has a low power consumption, making it ideal for applications that require long-term operation. Its wide range of features also enables it to be used in a variety of applications, including artificial intelligence, machine learning, and robotics.


Given the features and capabilities of the XCZU15EG-1FFVC900E chip model, it is expected that the demand for this model will continue to grow in the future. This is due to the increasing need for high-performance computing, networking, and storage solutions. Additionally, the chip model is expected to be used in a variety of new applications, such as artificial intelligence, machine learning, and robotics.


In order to use the XCZU15EG-1FFVC900E chip model effectively, it is important to understand the product description and specific design requirements. The product description includes the logic cell count, the power consumption, the range of features, and the supported applications. Additionally, it is important to understand the actual case studies and precautions associated with the chip model. This includes understanding the potential risks associated with the chip model and how to mitigate them.


The XCZU15EG-1FFVC900E chip model is well-suited for the development and popularization of future intelligent robots. This is due to its high logic cell count, low power consumption, and wide range of features and capabilities. Additionally, the chip model is expected to be used in a variety of new applications, such as artificial intelligence, machine learning, and robotics. In order to use the chip model effectively, it is important to have a deep understanding of the product description and design requirements. Additionally, it is important to have the technical skills necessary to work with the chip model, including understanding the potential risks associated with the chip model and how to mitigate them.



4,699 In Stock


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Unit Price: $1,745.6412
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,623.4463 $1,623.4463
10+ $1,605.9899 $16,059.8990
100+ $1,518.7078 $151,870.7844
1000+ $1,431.4258 $715,712.8920
10000+ $1,309.2309 $1,309,230.9000
The price is for reference only, please refer to the actual quotation!

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