AMD Xilinx
XCZU15EG-1FFVB1156I
XCZU15EG-1FFVB1156I ECAD Model
XCZU15EG-1FFVB1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU15EG-1FFVB1156I Datasheet Download
XCZU15EG-1FFVB1156I Overview
The XCZU15EG-1FFVB1156I chip model is a revolutionary new product that has been developed to meet the ever-growing demands of the industry. It is a high-performance, low-power, and high-speed integrated circuit that is designed to provide excellent performance in various applications. It is designed to be used in a variety of applications, such as mobile phones, tablets, and other consumer electronics.
The XCZU15EG-1FFVB1156I chip model has a number of advantages that make it an ideal choice for a wide range of applications. It has a high-speed, low-power, and low-cost design, which makes it suitable for a wide range of applications. Additionally, it has a high level of integration, which allows for the integration of many components into a single chip. This allows for the development of a wide range of applications with a single chip.
The XCZU15EG-1FFVB1156I chip model has been designed with the future in mind. It has the capability to be upgraded to meet future demands, as well as the ability to be used in advanced communication systems. This means that the chip model can be used in a wide range of applications, including the development and popularization of future intelligent robots.
In order to use the XCZU15EG-1FFVB1156I chip model effectively, it is important to have the right technical talent. This includes knowledge of the chip model, as well as the ability to develop applications that utilize the chip model. Additionally, it is important to have a good understanding of the various components that make up the chip model, as well as the ability to troubleshoot any problems that may arise.
The XCZU15EG-1FFVB1156I chip model is a revolutionary new product that has the potential to revolutionize the industry. With its high-performance, low-power, and high-speed design, it is an ideal choice for a wide range of applications. Additionally, its ability to be upgraded to meet future demands, as well as its ability to be used in advanced communication systems, makes it a great choice for the development and popularization of future intelligent robots. With the right technical talent, the XCZU15EG-1FFVB1156I chip model can be used to great effect.
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2,374 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,398.7557 | $3,398.7557 |
| 10+ | $3,362.2099 | $33,622.0992 |
| 100+ | $3,179.4811 | $317,948.1120 |
| 1000+ | $2,996.7523 | $1,498,376.1600 |
| 10000+ | $2,740.9320 | $2,740,932.0000 |
| The price is for reference only, please refer to the actual quotation! | ||