
AMD Xilinx
XCZU15EG-1FFVB1156E
XCZU15EG-1FFVB1156E ECAD Model
XCZU15EG-1FFVB1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU15EG-1FFVB1156E Datasheet Download
XCZU15EG-1FFVB1156E Overview
The XCZU15EG-1FFVB1156E chip model is a powerful tool for the future of technology. It is designed to provide users with a high performance, low power, and scalable solution for a wide range of applications. This chip model is the latest in a long line of Xilinx products that have been designed for high performance, low power, and scalability.
The XCZU15EG-1FFVB1156E chip model has a number of advantages that make it attractive for use in a variety of industries. It is capable of supporting multiple cores, each with its own set of instructions, and it is also capable of being reconfigured for different tasks. This makes it ideal for use in a wide range of applications, including networking, artificial intelligence, and robotics.
The expected demand for the XCZU15EG-1FFVB1156E chip model in the future is likely to be high. This is due to its high performance, low power, and scalability capabilities. It is also likely to be used in a variety of applications, including networking, artificial intelligence, and robotics.
The XCZU15EG-1FFVB1156E chip model can be used in networks and intelligent scenarios. It has the potential to be used in the era of fully intelligent systems, as it is capable of supporting multiple cores and being reconfigured for different tasks. It is also capable of being used in the development and popularization of future intelligent robots, as it has the power and scalability to support complex tasks.
In order to use the XCZU15EG-1FFVB1156E chip model effectively, a variety of technical talents are needed. These include software and hardware engineers, computer scientists, and electrical engineers. These individuals must have a strong knowledge of the chip model and its capabilities, as well as the ability to design and implement complex tasks with it. Additionally, individuals must have the necessary skills to develop and maintain the chip model for use in a variety of applications.
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1,590 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,833.9387 | $1,833.9387 |
10+ | $1,814.2189 | $18,142.1893 |
100+ | $1,715.6201 | $171,562.0077 |
1000+ | $1,617.0212 | $808,510.6110 |
10000+ | $1,478.9828 | $1,478,982.8250 |
The price is for reference only, please refer to the actual quotation! |