XCZU15EG-1FFVB1156E
XCZU15EG-1FFVB1156E
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rohs

AMD Xilinx

XCZU15EG-1FFVB1156E


XCZU15EG-1FFVB1156E
F20-XCZU15EG-1FFVB1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU15EG-1FFVB1156E ECAD Model


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XCZU15EG-1FFVB1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU15EG-1FFVB1156E Datasheet Download


XCZU15EG-1FFVB1156E Overview



The XCZU15EG-1FFVB1156E chip model is a powerful tool for the future of technology. It is designed to provide users with a high performance, low power, and scalable solution for a wide range of applications. This chip model is the latest in a long line of Xilinx products that have been designed for high performance, low power, and scalability.


The XCZU15EG-1FFVB1156E chip model has a number of advantages that make it attractive for use in a variety of industries. It is capable of supporting multiple cores, each with its own set of instructions, and it is also capable of being reconfigured for different tasks. This makes it ideal for use in a wide range of applications, including networking, artificial intelligence, and robotics.


The expected demand for the XCZU15EG-1FFVB1156E chip model in the future is likely to be high. This is due to its high performance, low power, and scalability capabilities. It is also likely to be used in a variety of applications, including networking, artificial intelligence, and robotics.


The XCZU15EG-1FFVB1156E chip model can be used in networks and intelligent scenarios. It has the potential to be used in the era of fully intelligent systems, as it is capable of supporting multiple cores and being reconfigured for different tasks. It is also capable of being used in the development and popularization of future intelligent robots, as it has the power and scalability to support complex tasks.


In order to use the XCZU15EG-1FFVB1156E chip model effectively, a variety of technical talents are needed. These include software and hardware engineers, computer scientists, and electrical engineers. These individuals must have a strong knowledge of the chip model and its capabilities, as well as the ability to design and implement complex tasks with it. Additionally, individuals must have the necessary skills to develop and maintain the chip model for use in a variety of applications.



1,590 In Stock


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Unit Price: $1,971.9771
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,833.9387 $1,833.9387
10+ $1,814.2189 $18,142.1893
100+ $1,715.6201 $171,562.0077
1000+ $1,617.0212 $808,510.6110
10000+ $1,478.9828 $1,478,982.8250
The price is for reference only, please refer to the actual quotation!

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