AMD Xilinx
XCZU11EG-L2FFVC1760E
XCZU11EG-L2FFVC1760E ECAD Model
XCZU11EG-L2FFVC1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-L2FFVC1760E Datasheet Download
XCZU11EG-L2FFVC1760E Overview
The XCZU11EG-L2FFVC1760E chip model is a high-performance model designed to meet the needs of digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which allows for a more efficient development process. With its high performance, it is ideal for applications that require a lot of computing power.
The XCZU11EG-L2FFVC1760E chip model offers many advantages compared to other models. It has a high clock frequency, which allows for faster processing times. It also has a large memory capacity, which allows for the storage of large amounts of data. Additionally, the chip model is designed to be power-efficient, which helps to reduce energy costs.
The XCZU11EG-L2FFVC1760E chip model is expected to be in high demand in the future. As technology continues to advance, more applications will require higher processing power. The XCZU11EG-L2FFVC1760E chip model is well-suited to meet these demands. Additionally, with its power-efficiency, it is a great choice for applications that require a lot of computing power without consuming too much energy.
The original design intention of the XCZU11EG-L2FFVC1760E chip model was to provide a high-performance model that is suitable for digital signal processing, embedded processing, and image processing. Additionally, it was designed to be used with the HDL language, which allows for a more efficient development process. In the future, the chip model may be upgraded to provide more computing power and memory capacity.
The XCZU11EG-L2FFVC1760E chip model can also be applied to advanced communication systems. It is capable of handling complex tasks, such as data encryption and decryption, as well as signal processing. Additionally, it is power-efficient, which helps to reduce energy costs for applications that require a lot of computing power. With its high performance and power-efficiency, the XCZU11EG-L2FFVC1760E chip model is well-suited for applications in advanced communication systems.
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1,618 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,038.5736 | $20,038.5736 |
| 10+ | $19,823.1050 | $198,231.0504 |
| 100+ | $18,745.7624 | $1,874,576.2371 |
| 1000+ | $17,668.4197 | $8,834,209.8530 |
| 10000+ | $16,160.1400 | $16,160,139.9750 |
| The price is for reference only, please refer to the actual quotation! | ||