AMD Xilinx
XCZU11EG-L1FFVF1517I
XCZU11EG-L1FFVF1517I ECAD Model
XCZU11EG-L1FFVF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-L1FFVF1517I Datasheet Download
XCZU11EG-L1FFVF1517I Overview
The chip model XCZU11EG-L1FFVF1517I is a high-performance chip designed to meet the needs of digital signal processing, embedded processing, and image processing. It is based on the Xilinx Zynq UltraScale+ MPSoC architecture and requires the use of HDL language for programming. It boasts high-performance processing capabilities and is suitable for high-end applications.
The industry trends of the chip model XCZU11EG-L1FFVF1517I and the future development of related industries depend on what specific technologies are needed. It is likely that the application environment will require the support of new technologies, such as AI, machine learning, and IoT. As the chip model is designed for high-performance applications, it can be applied to the development and popularization of future intelligent robots.
In order to use the chip model XCZU11EG-L1FFVF1517I effectively, technical talents with knowledge of HDL language and experience in digital signal processing, embedded processing, and image processing are needed. They should also be familiar with the Xilinx Zynq UltraScale+ MPSoC architecture and the latest technologies related to AI, machine learning, and IoT. With the right technical talent, the chip model can be used to create powerful intelligent robots.
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1,448 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,406.1573 | $2,406.1573 |
| 10+ | $2,380.2846 | $23,802.8463 |
| 100+ | $2,250.9213 | $225,092.1333 |
| 1000+ | $2,121.5580 | $1,060,779.0190 |
| 10000+ | $1,940.4494 | $1,940,449.4250 |
| The price is for reference only, please refer to the actual quotation! | ||