AMD Xilinx
XCZU11EG-L1FFVC1760I
XCZU11EG-L1FFVC1760I ECAD Model
XCZU11EG-L1FFVC1760I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU11EG-L1FFVC1760I Datasheet Download
XCZU11EG-L1FFVC1760I Overview
The XCZU11EG-L1FFVC1760I chip model is a powerful model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, and its possible future applications are vast. It is possible that the chip model can be applied to networks and intelligent scenarios, such as the development and popularization of future intelligent robots.
The XCZU11EG-L1FFVC1760I chip model is a great tool for those looking to create complex digital signal processing, embedded processing, and image processing systems. It has the power to process large amounts of data quickly and accurately, making it ideal for applications that require high-performance computing. It is also capable of being used in the era of fully intelligent systems, making it a great choice for those who are looking to create intelligent systems that can leverage the power of the chip model.
The XCZU11EG-L1FFVC1760I chip model can also be used to develop and popularize future intelligent robots. It has the power to process large amounts of data quickly and accurately, making it ideal for developing and deploying robots that can learn and respond to their environment. It is also capable of being used in the era of fully intelligent systems, allowing robots to become smarter and more capable of adapting to their environment.
In order to use the XCZU11EG-L1FFVC1760I chip model effectively, technical talents in the area of HDL language are needed. Those who are familiar with the language will be better equipped to utilize the chip model to its fullest potential. Additionally, those with a good understanding of robotics and artificial intelligence will be able to better utilize the chip model to create intelligent robots that can learn and respond to their environment.
Overall, the XCZU11EG-L1FFVC1760I chip model is a powerful model that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is also capable of being used in the era of fully intelligent systems, making it a great choice for those who are looking to create intelligent systems that can leverage the power of the chip model. Those who are familiar with HDL language and robotics and artificial intelligence will be the best equipped to use the model effectively.
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3,460 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17,536.0955 | $17,536.0955 |
| 10+ | $17,347.5354 | $173,475.3536 |
| 100+ | $16,404.7345 | $1,640,473.4529 |
| 1000+ | $15,461.9337 | $7,730,966.8470 |
| 10000+ | $14,142.0125 | $14,142,012.5250 |
| The price is for reference only, please refer to the actual quotation! | ||