
AMD Xilinx
XCZU11EG-L1FFVC1156I
XCZU11EG-L1FFVC1156I ECAD Model
XCZU11EG-L1FFVC1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-1156 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU11EG-L1FFVC1156I Datasheet Download
XCZU11EG-L1FFVC1156I Overview
The chip model XCZU11EG-L1FFVC1156I is a powerful and versatile chip model released by Xilinx, a leading provider of programmable logic devices. It is designed for a variety of applications, including network processing, image processing, machine learning, and more. With its advanced features, XCZU11EG-L1FFVC1156I is well-suited for the modern era of highly intelligent systems.
The XCZU11EG-L1FFVC1156I chip model has the potential to revolutionize the industry. It is equipped with a comprehensive set of features, including a high-performance processing engine, a wide range of memory options, and a highly efficient power management system. This makes it ideal for applications requiring high performance, low power consumption, and a wide range of memory options.
In addition to its impressive features, the XCZU11EG-L1FFVC1156I chip model is also capable of supporting a wide range of technologies. This includes support for a variety of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. It also supports a range of programming languages, including C, C++, and Python. This makes it highly versatile and suitable for a variety of applications.
The XCZU11EG-L1FFVC1156I chip model is also designed to be highly reliable and robust. It is designed to be durable and able to withstand harsh operating conditions. It is also designed to be highly resistant to interference, ensuring that it can operate reliably in a variety of environments.
The XCZU11EG-L1FFVC1156I chip model has a number of possible applications in the field of networks and intelligent systems. It can be used to create intelligent networks, allowing for the integration of multiple devices and services. It can also be used to create intelligent systems, allowing for the integration of multiple services and applications. This makes it an ideal solution for a variety of intelligent scenarios.
In terms of product design requirements, the XCZU11EG-L1FFVC1156I chip model requires a certain level of expertise to use effectively. It is important that users are aware of the specific features and capabilities of the chip model, as well as the specific design requirements for their application. Additionally, it is important to consider the specific environment in which the chip model will be used, as this can have a significant impact on its performance.
To ensure that the XCZU11EG-L1FFVC1156I chip model is used effectively, it is important to consider actual case studies and precautions. This can help to ensure that the chip model is used correctly and in the most efficient manner. Additionally, it is important to consider the industry trends and future development of related industries, as this can help to determine whether the application environment requires the support of new technologies.
Overall, the XCZU11EG-L1FFVC1156I chip model is a powerful and versatile chip model that has the potential to revolutionize the industry. With its advanced features and wide range of technologies, it is well-suited for the modern era of highly intelligent systems. However, it is important to consider the product design requirements, actual case studies, and precautions to ensure that the chip model is used effectively. Additionally, it is important to consider the industry trends and future development of related industries to determine whether the application environment requires the support of new technologies.
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4,416 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,198.7510 | $2,198.7510 |
10+ | $2,175.1085 | $21,751.0853 |
100+ | $2,056.8961 | $205,689.6108 |
1000+ | $1,938.6837 | $969,341.8440 |
10000+ | $1,773.1863 | $1,773,186.3000 |
The price is for reference only, please refer to the actual quotation! |