XCZU11EG-L1FFVB1517I
XCZU11EG-L1FFVB1517I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU11EG-L1FFVB1517I


XCZU11EG-L1FFVB1517I
F20-XCZU11EG-L1FFVB1517I
Active
CMOS, FCBGA-1517
FCBGA-1517

XCZU11EG-L1FFVB1517I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU11EG-L1FFVB1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-1517
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU11EG-L1FFVB1517I Datasheet Download


XCZU11EG-L1FFVB1517I Overview



The XCZU11EG-L1FFVB1517I chip model is a high-performance and versatile model, suitable for a variety of applications including high-performance digital signal processing, embedded processing, image processing, etc. It is designed to be used with the HDL language, which is a hardware description language that is used to describe the behavior of digital logic circuits.


The XCZU11EG-L1FFVB1517I chip model has a wide range of features that make it suitable for a variety of applications. It has a high-performance processor core, a large internal memory, and an array of digital signal processing (DSP) blocks. It also supports a wide range of peripherals, including Ethernet, USB, and PCIe. It is designed to be used with the Vivado Design Suite, which is a powerful design tool that enables users to quickly and easily create complex designs.


The XCZU11EG-L1FFVB1517I chip model can be used in the development and popularization of future intelligent robots. It has the necessary features to be used in robotics applications, such as its high-performance processor core, large internal memory, and array of DSP blocks. However, using the XCZU11EG-L1FFVB1517I chip model for robotics applications requires a certain level of technical skill. Knowledge of HDL language and the Vivado Design Suite is necessary for effective use of the chip model. Additionally, knowledge of robotics and artificial intelligence is also necessary for successful development and popularization of intelligent robots.


In conclusion, the XCZU11EG-L1FFVB1517I chip model is a versatile and powerful model suitable for a variety of applications, including robotics. However, effective use of the chip model requires a certain level of technical skill, including knowledge of HDL language, the Vivado Design Suite, robotics, and artificial intelligence.



2,105 In Stock


I want to buy

Unit Price: $2,587.2659
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $2,406.1573 $2,406.1573
10+ $2,380.2846 $23,802.8463
100+ $2,250.9213 $225,092.1333
1000+ $2,121.5580 $1,060,779.0190
10000+ $1,940.4494 $1,940,449.4250
The price is for reference only, please refer to the actual quotation!

Quick Quote